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Qualcomm Powers Next Generation of Windows 8-Based Prototype PCs Previewed at Microsoft BUILD Conference - Qualcomm will enable Windows 8 through extensive product portfolio of snapdragon next generation processors and Gobi wireless connectivity solutions (NASDAQ: QCOM)
Qualcomm Powers Next Generation of Windows 8-Based Prototype PCs Previewed at Microsoft BUILD Conference

 

NewswireTODAY - /newswire/ - Anaheim, CA, United States, 2011/09/13 - Qualcomm will enable Windows 8 through extensive product portfolio of snapdragon next generation processors and Gobi wireless connectivity solutions (NASDAQ: QCOM). NASDAQ: QCOM

   
 
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Qualcomm Incorporated today announced that Qualcomm and Microsoft are collaborating to enable Qualcomm’s Snapdragon™ next generation family of mobile processors to power the first generation of upcoming Windows 8-based PCs, becoming one of the only silicon providers to date positioned to support both Windows smartphones and PCs. In addition, Qualcomm’s Gobi™ mobile Internet connectivity solutions will provide Windows 8-based PCs with wireless 3G/4G connectivity to deliver an always-connected experience. Microsoft Corp. demonstrated an early developer preview of Windows 8-based prototype PCs powered by Snapdragon processors and Gobi connectivity during the keynote address at BUILD earlier today.

“We are excited to be at BUILD to show the Windows ecosystem and how we are working together towards commercialization of apps and hardware that will run Windows 8,” said Luis Pineda, senior vice president of product management, computing and consumer products at Qualcomm. “It is a priority for Qualcomm to work with the developer community to optimize the Snapdragon and Gobi-powered platform for Windows 8 to provide an unparalleled mobile user experience.”

As one of the largest providers of wireless chipset and software technology in the industry, Qualcomm has one of the most diverse chipset and software product portfolios spanning multiple device classes. The next generation of Snapdragon processors is a family of all-in-one chipsets with the option for integrated multimode 3G/4G, differing numbers of CPU cores and the ability to support a range of device types.

Shown for the first time, Qualcomm’s Gobi solution provided the 3G/4G LTE connectivity of a Windows 8-based prototype PC. Qualcomm’s Gobi mobile Internet connectivity solution is a pre-certified multi-mode 3G/4G LTE module that makes it easy for OEMs to certify the connectivity of any Windows 8-based PC. By integrating a Gobi-based module into Windows 8-based PCs, Qualcomm will provide a fast, easy-to-use global connectivity solution for an untethered, productive user experience.

Qualcomm’s Snapdragon family of mobile processors also delivers dual-band Wi-Fi®, Bluetooth and FM radio connectivity through Qualcomm Atheros’ WCN3660 combo chip. The WCN3660 is an integrated solution optimized to work with a broad range of mobile operating systems and will be the first in a series of 802.11n wireless LAN solutions to fully support Windows 8.

“Collaborating with Qualcomm to deliver Windows 8-based PCs will help deliver a high-performance and differentiated experience for customers,” said Mike Angiulo, corporate vice president of Windows planning, hardware and PC ecosystem, Microsoft. “Working closely with Qualcomm allows us to maximize performance while maintaining a high level of energy efficiency.”

To see the developer preview Windows 8 demonstrations powered by Snapdragon processors and Gobi, please visit booth number six at the BUILD conference on September 13-16 in Anaheim, Calif. or visit qualcomm.com/snapdragon.

About Qualcomm
Qualcomm Incorporated (qualcomm.com) is the world leader in 3G and next-generation mobile technologies. For 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere.

Follow us: Corporate Blog: qualcomm.com/blog | Twitter: twitter.com/qualcomm | Facebook: facebook.com/qualcomm

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of mobile processors and 3G/4G LTE components on a timely and profitable basis, the extent and speed to which 3G and 4G LTE are deployed, the extent of the successful commercialization of Windows 8 tablets and notebooks, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 26, 2010, and most recent Form 10-Q. The Company undertakes no obligation to update, or continue to provide information with respect to, any forward-looking statement or risk factor, whether as a result of new information, future events or otherwise.

Qualcomm is a registered trademark of Qualcomm Incorporated. Snapdragon and Gobi are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All other trademarks are the property of their respective owners.

Qualcomm Contact
Warren Kneeshaw, Investor Relations
P: 1-858-658-4813 / E: ir[.]qualcomm.com.

 
 
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Qualcomm Powers Next Generation of Windows 8-Based Prototype PCs Previewed at Microsoft BUILD Conference

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Qualcomm Incorporated |
Contact: Tina Asmar - Qualcomm.com 
corpcomm[.]qualcomm.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any QUALCOMM, Inc. securities in any jurisdiction including any other companies listed or named in this release.

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