MOST TRUSTED NEWSWIRE PRESS RELEASE DISTRIBUTION
PRTODAY / NewswireToday press release distribution service network
Written by / Agency / Source: Imec
Check Ads Availability|e-mail Article

Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Imec Demonstrates 3D Integrated DRAM-on-logic for Low-power Mobile Applications - SEMICON WEST- Booth 1724, South Hall, Moscone Center, San Francisco, US
Imec Demonstrates 3D Integrated DRAM-on-logic for Low-power Mobile Applications

 

NewswireToday - /newswire/ - Leuven, Belgium, 2011/07/12 - SEMICON WEST- Booth 1724, South Hall, Moscone Center, San Francisco, US.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics / Instrumentation / RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs.

The 3D stack resembles as close as possible to future commercial chips. It consists of imec’s proprietary logic CMOS IC on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps. Heaters were integrated to test the impact of hotspot on DRAM refresh times. And, the chip contains test structures for monitoring thermo-mechanical stress in a 3D stack, ESD (electro-static discharge) hazards, electrical characteristics of TSVs and micro-bumps, fault models for TSVs, etc.

Imec’s 3D integrated DRAM-on-logic demonstrator showed that a minimum die thickness of 50µm is required to deal with local hot spots on the logic die, which are generated by local power dissipation. Due to the strongly reduced lateral heat spreading capability of thin die, these hot spots are higher in temperature and more confined if the die thickness is reduced.

The hot spots on the logic die cause local temperature increases in the memory die. This may cause a reduction in retention time of the DRAM devices. However, imec’s 3D stacked demonstrator has proven that the DRAM may not be thermally isolated from the logic die since the DRAM die also acts as an effective heat spreader for the logic die. As such the intensity of the hot spot is reduced and thereby the temperature rise in the DRAM device is strongly limited.

The results of the various experiments allowed us to calibrate our thermal models which are implemented in 3D EDA tools. They have proven to be valuable means to design next-generation 3D stacked ICs. The design of the 3D chip is realized together with many players in the 3D integration supply chain.

“We are excited to achieve this milestone in collaboration with our 3D integration partners including memory suppliers and IC manufacturers. This test-chip and our 3D design tools and thermal models are an important step for the introduction of 3D technology in DRAM-on-logic for mobile applications;” said Luc Van den hove, president and CEO imec. “To boost the performance towards high-end applications, imec will set up a cooling research program.”

This work was executed in collaboration with imec’s key partners in its core CMOS programs Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor and Qualcomm.

About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec (imec.be) delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of about 1,900 people includes over 550 industrial residents and guest researchers. In 2010, imec's revenue (P&L) was 285 million euro.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics / Instrumentation / RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Imec

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick NewswireToday Visibility Checker

 

Distribution / Indexing: [+]  / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Electronics / Instrumentation / RFID articles,
CATCH Visitors via Your Competitors Announcements!


Imec Demonstrates 3D Integrated DRAM-on-logic for Low-power Mobile Applications

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name NewswireToday and LINK as the source.
 
Publisher Contact: Katrien Marent - imec.be 
+32 16 28 18 80 katrien.marent[.]imec.be
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Imec securities in any jurisdiction including any other companies listed or named in this release.

Electronics / Instrumentation / RFID via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY

Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Imec / Company Profile


Read Electronics / Instrumentation / RFID Most Recent Related Newswires:

Curtiss-Wright to Deliver Turret Drive System and Australian Industry Capability for Land 400 Phase 2 Program
Retail Software Experts, Detego, Expands Presence into US as Part of Ambitious Growth Plans
Bruker Introduces Breakthrough MALDI-2 Source on timsTOF fleX, and Further Innovations in CCS-Enabled 4D Proteomics on timsTOF
Grandstream Officially Releases On-Premise Software Controller for Wi-Fi APs
Datalogic Launches Smart-VS™ - The Unique Device with the Power of Machine Learning and the Ease of Photoelectric Sensors
Curtiss-Wright Selected by KAI to Provide Complete Data Acquisition System Solution for New 5th Generation Fighter Aircraft
Imec Combines Advanced Machine Learning Algorithms and Innovations in Chip Design to Achieve cm Accuracy and Low-power Ultra Wideband Localization
Fujikura and Bruker Collaboration - A 1.2 GHz NMR Magnet Built with Japanese HTS Tape Reaches Field at Bruker’s Factory
Lopos, A Spin-off of Imec and the Ghent University, Presents the SafeDistance Wearable
Curtiss-Wright Debuts Highly Accurate ADC Modules for RTD Temperature Sensors in Flight Test Data Acquisition Programs
Curtiss-Wright Introduces Embedded Industry’s Smallest, Lightest Rugged Secure Cisco® IP Router
Roswell Biotechnologies and Imec to Develop First Molecular Electronics Biosensor Chips for Infectious Disease Surveillance
Curtiss-Wright Announces New Balanced 'Side-by-Side' Packaging Option for Data Acquisition Systems for Flight Test Instrumentation
Imec Builds World’s First Spiking Neural Network-Based Chip for Radar Signal Processing
Curtiss-Wright’s Rugged Data Acquisition Solution Supports NASA’s First Night-Time Launch of Suborbital Sounding Rocket Test Flights

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  La Bella Bakery Artisan Bakery Arizona

Visit Apex Watercraft





 
  ©2020 NewswireToday — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com newswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)