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• Qualcomm Dragonwing™ Q-2390 and IQ-2390 processors significantly expand access to intelligently connected devices across the IoT industry, lowering barriers by adding intelligence, vision and connectivity to devices deployed in homes, businesses and factories around the world.
• As the latest addition to the Dragonwing Q2 Series, the Dragonwing Q-2390 processor enables a new class of intelligent commercial and consumer devices, with capabilities to support applications ranging from retail and smart home products to smart displays and enterprise edge devices.
• The Dragonwing IQ-2390 processor is the first product in the new Dragonwing IQ2 Series, delivering industrial intelligence in a compact, cost-optimized platform, integrating AI, vision, deterministic networking and real-time processing for industrial automation, machine vision, building management and energy systems.
Ahead of IFA, Qualcomm Technologies, Inc. today announced the Qualcomm Dragonwing™ Q-2390 and IQ-2390 processors, expanding the Dragonwing portfolio with highly integrated platforms designed to make intelligent edge computing more accessible to consumer, commercial and industrial segments. As demand grows for devices that can perceive, analyze and act on data locally, the Dragonwing Q-2390 and IQ-2390 processors are designed to bring AI, vision, connectivity and security to a broader range of connected devices, helping power the next wave of intelligence across homes, businesses, cities and factories.
“AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration," said Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc. "With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before."
The Dragonwing Q-2390 Processor: Bringing Intelligent Experiences to Commercial and Consumer IoT
The Dragonwing Q-2390 processor is designed for edge-intelligent commercial, enterprise and consumer products that require advanced capabilities within tight cost, power and size constraints. By integrating application compute, on-device AI, camera and display support, LTE Cat 4 and GPS location capabilities, flexible wired and wireless connectivity options, security and extensive I/O capabilities into a single platform, Dragonwing Q-2390 enables a new generation of intelligent connected products. Applications include retail point-of-sale systems, kiosks, access control devices, smart appliances, smart agriculture, home robots, fitness equipment and enterprise terminals, helping device makers deliver richer user experiences while reducing system complexity and development costs.
Dragonwing IQ-2390 Processor: Proliferating Intelligence to the Far Industrial Edge
The Dragonwing IQ-2390 processor is the first processor in the new IQ2 Series, a family of industrial edge AI processors designed to extend intelligent computing to a broader range of industrial and compute applications. Complementing the Dragonwing IQ10, IQX, IQ9, IQ8 and IQ6 Series portfolios, Dragonwing IQ-2390 aims to bring intelligence to compact edge systems that require reliable operation, real-time responsiveness and long product lifecycles across industrial automation, oil & gas, utilities and energy applications. Combining application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking (TSN), Dragonwing IQ-2390 processor helps enable smarter HMIs, PLCs, gateways, industrial vision systems, building automation platforms and energy management solutions. Built to support industrial deployments, the Dragonwing IQ-2390 processor is designed to support operation across an extended temperature range of -30°C to +115°C, and includes features intended to support operation in environments subject to vibration and shock, making it well suited for performance in factories, energy infrastructure and outdoor industrial environments. The result is a highly integrated architecture that aims to simplify deployment of AI-enabled industrial systems while helping manufacturers reduce bill of materials, board space and integration complexity, all in a ruggedized package that demanding industrial applications require.
Both processers feature a quad-core Qualcomm® Kryo™ CPU, a Qualcomm® Adreno™ 704 GPU, and a real-time RISC-V MCU. Together, these platforms help enable OEMs and developers to build smarter connected devices while reducing design complexity, lowering system cost, and accelerating time-to-market. With support for Linux, Android, and Zephyr OS, the platforms are designed to offer developers the flexibility to build differentiated products across a variety of IoT segments.
Industry Support
• “At Eight Development, we build scalable platforms that support mission-critical products across security, fire, life safety, and building automation, so every technology decision has to serve an entire product family for years to come,” stated Jason Mackie, CEO and Founder, Eight Development Limited. “With an integrated real-time MCU and a place within the broader Dragonwing portfolio, the Q-2390 helps us simplify system design while giving customers a platform that can scale across product tiers and generations."
• “Fibocom is developing the SC236 smart module based on the Dragonwing Q-2390 processor,” said Thales Zhang, Vice President of Fibocom. “By integrating AI, vision processing, and multi-mode connectivity capabilities, while also providing reference designs and application development support, we aim to help device manufacturers in areas such as smart payment terminals and industrial handheld devices simplify system integration and accelerate product development and time to market.”
• "At SECO, our goal is to help customers move from concept to deployment faster with production-ready hardware and software platforms," stated Lorenzo Veltroni, Chief Product and Marketing Officer at SECO. "With Compact Vision 5 with Dragonwing IQ-2390 and SBC with Dragonwing-IQ-2390, we provide two complementary solutions built on the Dragonwing IQ-2390 platform, giving developers a streamlined path to bring intelligent industrial devices to market. Combined with the Clea software framework, they create a scalable foundation for connected products, edge AI, and long-term lifecycle management."
• “At Engicam, we are committed to advancing embedded computing and accelerating innovative projects,” said Milco Pratesi, CTO, Engicam. “By developing a SOM powered by the Dragonwing IQ-2390 processor, we can help customers modernize their industrial products and bring intelligent solutions to market faster.”
The Dragonwing Q-2390 and IQ-2390 SOMs can be seen on-site at IFA 2026, with customer engagement already underway through an early access program. Evaluation kits for both platforms are expected to be available in early 2027.
About Qualcomm
Qualcomm (qualcomm.com) is a global computing leader at the center of the AI era, enabling intelligence to scale from the most personal devices to large‑scale infrastructure. Building on more than four decades of innovation, we develop platforms and solutions that bring together advanced AI, high‑performance, low-power computing and industry‑leading connectivity powering products and services used around the world. At Qualcomm, we are engineering human progress.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated. Qualcomm, Snapdragon, Qualcomm Dragonwing and Qualcomm Dragonfly are trademarks or registered trademarks of Qualcomm Incorporated.
Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm, Qualcomm Dragonwing and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
Qualcomm, Kryo and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated.
Contact Information: Brett Simpson - Investor Relations
P: 858-658-4813 - E: ir[.]qualcomm.com.
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