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Ezurio, a global leader in wireless connectivity and Premium Partner for Infineon Technologies, announces that the Veda IF912 and IF913 series connected MCU modules are now in stock and available for purchase through its global distribution network. Powered by Infineon's AIROC™ CYW55912 and CYW55913 chipsets, the Veda series is a breakthrough, low-power high, performance solution that combines next-generation Wi-Fi and Bluetooth LE with a fully integrated application MCU subsystem enabling engineers to build smarter, smaller, and longer-lasting IoT devices.
Building connected IoT products just got simpler. Ezurio's new Veda IF912 and IF913 modules put Wi-Fi 6 (or 6E), Bluetooth LE 5.4, a 192 MHz application processor, and memory, into a single certified 7 × 11 mm package - so engineers can eliminate the separate host MCU, shrink their BOM, and get to production faster.
The Veda IF91x series, powered by Infineon's AIROC™ CYW55912 and CYW55913 chipsets, supports two operating modes. Run the full application directly on the module in SoC mode, or use it as a network coprocessor alongside an existing host in NCP mode. Either way, the result is a simpler design, a smaller board, and fewer integration headaches.
"Most of our customers spend months integrating a host MCU with a separate radio module. Veda IF91x changes that conversation entirely the MCU is already there, already certified, already talking to the radio. You can go straight to writing your application.” said Andy Ross, Senior Product Manager, Ezurio.
Key features of the Veda IF912 and IF913:
• Wi-Fi 6 dual-band (IF912) or Wi-Fi 6E tri-band (IF913) + Bluetooth LE 5.4;
• ARM Cortex-M33 @ 192 MHz with ultra-low power sensor hub;
• Flexible SoC and NCP operating modes, powered by Infineon MODUS Toolbox;
• 8 MB Flash + 8 MB PSRAM (integrated or customer-added variants available);
• Enterprise-grade security: WPA2/3, secure boot, Anti-rollback, hardware key storage;
• Matter and IP networking support for secure cloud connectivity;
• Ultra-compact 7 × 11 × 1.4 mm SMT package, 40 °C to +85 °C.
“As a valued module partner, Ezurio’s Veda IF912 and IF913 showcase the power of combining wireless expertise with leading-edge silicon," said Shantanu Bhalerao, Vice President, Wireless Product Line, Infineon Technologies. "The AIROC CYW55912 and CYW55913 are designed to redefine what a connectivity module can do integrating a full application MCU and ultra-low power architecture alongside best-in-class Wi-Fi 6 and 6E. We are pleased to see Ezurio bring this technology to market and look forward to continuing our partnership"
The Veda IF912 and IF913 carry worldwide FCC, IC, CE, UKCA, RCM, MIC, KCC, and Bluetooth SIG approvals. Pre-certified antenna options including the FlexMIMO, FlexPIFA, and Mini NanoBlade Flex series are available for simplified regulatory compliance. The Veda IF912 and IF913 are available now through Ezurio's global distribution partners. Development kits for both modules are also available for immediate shipment.
About Ezurio
Ezurio (ezurio.com) engineers embedded wireless connectivity and compute solutions that power connected devices worldwide, backed by deep expertise in software, security, regulatory compliance, and long-term lifecycle support. Our portfolio includes RF modules, system-on-modules, single board computers, internal antennas, IoT devices, and custom solutions designed to accelerate development and reduce time to market.
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