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• MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets.
• Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using the Snapdragon Ride Flex system-on-chip.
• Companies’ agreement extends beyond ADAS development, with plans to deliver broader SDV solutions based on Snapdragon automotive technologies.
The MOU signing, held at the Hyundai Mobis booth, was attended by Jung Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm Technologies, Inc.
Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology.
The companies will begin their work with their co‑development of advanced driving and parking solutions based on the Snapdragon Ride™ Flex system-on-chip (SoC). These innovations will target fast‑growing markets such as India, where ADAS adoption is expanding across vehicle segments alongside rising demand for SDV‑ready architectures. For future SDV applications, they will also work together on next‑generation integrated solutions that combine Hyundai Mobis’s standardized software platform with Qualcomm Technologies’ Snapdragon® automotive technologies to enhance performance, efficiency, and stability.
About Hyundai Mobis
Hyundai Mobis (mobis.com) is the global no. 6 automotive supplier, headquartered in Seoul, Korea. Hyundai Mobis has outstanding expertise in sensors, sensor fusion in ECUs and software development for safety control. The company's products also include various components for electrification, brakes, chassis and suspension, steering, airbags, lighting, and automotive electronics. Hyundai Mobis operates its R&D headquarters in Korea, with four technology centers in the United States, Germany, China, and India.
About Qualcomm
Qualcomm (qualcomm.com) relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Building on our 40 years of technology leadership in creating era-defining breakthroughs, we deliver a broad portfolio of solutions built with our leading-edge AI, high-performance, low-power computing, and unrivaled connectivity. Our Snapdragon® platforms power extraordinary consumer experiences, and our Qualcomm Dragonwing™ products empower businesses and industries to scale to new heights. Together with our ecosystem partners, we enable next-generation digital transformation to enrich lives, improve businesses, and advance societies. At Qualcomm, we are engineering human progress.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated.
Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm, Qualcomm Dragonwing and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
Contact: Mauricio Lopez-Hodoyan - Investor Relations
P: 858-658-4813 - E: ir[.]qualcomm.com.
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