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Mercedes-Benz and Qualcomm Collaborate to Power Upcoming Mercedes Vehicles with Snapdragon Digital Chassis Solutions - Mercedes to Utilize Snapdragon Cockpit and Auto Connectivity Platforms to deliver best-in-class driving experiences - Mercedes-Benz.com / Qualcomm.com
Mercedes-Benz and Qualcomm Collaborate to Power Upcoming Mercedes Vehicles with Snapdragon Digital Chassis Solutions

 

NewswireTODAY - /newswire/ - New York, NY, United States, 2022/09/23 - Mercedes to Utilize Snapdragon Cockpit and Auto Connectivity Platforms to deliver best-in-class driving experiences - Mercedes-Benz.com / Qualcomm.com. NASDAQ: QCOM

   
 
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Mercedes-Benz AG (mercedes-benz.com) and Qualcomm Technologies, Inc. today announced the companies’ work to utilize Snapdragon® Digital Chassis™ solutions to bring the latest and most digitally advanced capabilities to upcoming Mercedes-Benz vehicles. Building on the companies’ long-standing technology relationship spanning across multiple technology generations, Mercedes-Benz is integrating Snapdragon® Cockpit Platforms to power digital cockpits, as well as Snapdragon® Automotive Connectivity Platforms for telematics systems, in upcoming vehicles. Combining Mercedes-Benz’s expertise in vehicle innovation with Qualcomm Technologies’ growing portfolio of automotive solutions, the companies’ collective efforts are aimed to deliver personalized, intuitive, and safer driving experiences to consumers.

As digital cockpits continue to play a critical role in enabling robust and premium in-vehicle experiences that consumers now expect, Mercedes-Benz is leveraging the Snapdragon Cockpit Platforms to power intuitive and intelligent infotainment systems. With the Snapdragon Cockpit Platforms, these next generation systems will feature rich, immersive in-vehicle experiences, as well as highly intuitive artificial intelligence (AI) experiences for in-car virtual assistance, natural interactions between the vehicle and driver, adapting the vehicle to suit the driver and passenger.

Utilizing the Snapdragon Automotive Connectivity Platforms, Mercedes-Benz vehicles features ultra-fast connectivity, quick network response times and reliability needed to support always on always connected experiences and safety.

“For many years, Qualcomm Technologies has helped us deliver innovative solutions to our customers,” said Magnus Ostberg, chief software officer, Mercedes-Benz AG. “Our strong relationship is vital to guiding the automotive industry through a time of exceptional growth and technological disruption.”

“We are proud to bring our Snapdragon Digital Chassis solutions to Mercedes-Benz,” said Nakul Duggal, senior vice president & GM, automotive, Qualcomm Technologies, Inc. “Our technology partnership is transforming Mercedes-Benz vehicles as we deliver unparalleled compute, performance, AI and safety experiences by providing premium solutions for their next generation of automobiles.”

About Qualcomm

Qualcomm (qualcomm.com) is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research, and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

Snapdragon and Digital Chassis are trademarks or registered trademarks of Qualcomm Incorporated.
Snapdragon Cockpit Platforms, Snapdragon Automotive Connectivity Platforms and Snapdragon Digital Chassis are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Contact: Mauricio Lopez-Hodoyan - Investor Relations
P: 858-658-4813 - E: ir[.]qualcomm.com.

 
 
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Mercedes-Benz and Qualcomm Collaborate to Power Upcoming Mercedes Vehicles with Snapdragon Digital Chassis Solutions

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Digital Chassis | Qualcomm
Contact: Pete Lancia - Qualcomm.com 
858-845-5959 corpcomm[.]qualcomm.com
 
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any QUALCOMM, Inc. securities in any jurisdiction including any other companies listed or named in this release.

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