• Qualcomm Technologies builds on its One Technology Roadmap and leading position in RF Front-End (RFFE) in handsets to extend cutting-edge RFFE solutions into new device categories.
• 5G coexistence and purpose-built design for Wi-Fi 6E/7 showcase the Company’s leadership in both wireless technologies.
Qualcomm Technologies, Inc. today announced new RFFE modules targeted for best-in-class Wi-Fi and Bluetooth experiences. The expanded portfolio is designed for Bluetooth, Wi-Fi 6E, and the next-generation standard, Wi-Fi 7. The modules are designed for a wide array of device segments beyond smartphones including automotive, XR, PCs, wearables, mobile broadband, IoT, and more.
“With Qualcomm Technologies’ new products, we are extending our RFFE leadership into automotive and IoT, helping OEMs address their massive industry-specific challenges like development cost and scalability,” said Christian Block, senior vice president and general manager, RFFE, QUALCOMM Germany RFFE GmbH. “OEMs using our solutions can design products with higher performance, longer battery life and reduced commercialization time, ultimately accelerating the pace of innovation and delivering improved experiences to consumers.”
In fiscal year 2021, Qualcomm Technologies reached the #1 position in RFFE revenues for handsets. The introduction of the new RFFE modules aligns with the Company strategy to extend handset leadership with modem-to-antenna solutions into automotive and IoT positioning Qualcomm Technologies to be a global RFFE revenue leader across various industries. Today, most the 5G automotive, 5G fixed wireless access CPEs (customer premise equipment) and 5G PC devices announced or in development using Qualcomm Technologies’ connectivity chips include RFFE content from the Company. In addition, Qualcomm® RFFE is increasingly being adopted in consumer IoT devices, such as wearables.
Wi-Fi RFFE modules bring together key components required between the Wi-Fi baseband chip and antennas to amplify and adapt signals for optimal wireless transmission. Manufacturers use these modules to quickly and cost-effectively develop Wi-Fi client devices. The new modules announced today feature 5G/Wi-Fi coexistence capabilities, and complement Qualcomm® ultraBAW™ filters to allow 5G/Wi-Fi concurrency, enhancing wireless performance in cellular devices.
Manufacturers can use the new modules along with Qualcomm Technologies’ client connectivity products, such as Qualcomm® FastConnect™ 7800 Wi-Fi 7/Bluetooth Systems and Snapdragon® 5G Modem-RF Systems for cutting-edge wireless such as those devices featuring Snapdragon® Connect. Or they can use 3rd party Wi-Fi and Bluetooth chipsets along with the modules.
The new front end modules are currently sampling to customers. Commercial devices featuring the new solutions are expected to launch by the second half of 2022. For more details, please read our OnQ blog.
Qualcomm (qualcomm.com) is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.
Qualcomm, FastConnect, Snapdragon, and ultraBAW are trademarks or registered trademarks of Qualcomm Incorporated.
Qualcomm ultraBAW, Qualcomm FastConnect, Snapdragon and Qualcomm RFFE are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Contact: Mauricio Lopez-Hodoyan - Investor Relations
P: 858-658-4813 - E: ir[.]qualcomm.com.