• Supports advanced bidirectional communication in smart grid applications to help manage and balance energy flow between electric vehicles and the grid;
• Qualcomm Technologies is working with virtually all global, leading automakers and their supply base in support of the Combined Charging Systems international standard for charging electric vehicles;
• In alignment with Qualcomm Incorporated’s environmental sustainability efforts, this device also has the potential to contribute to substantially reducing greenhouse gas emissions.
In continued efforts to support the growing electric vehicle (EV) segment, Qualcomm Technologies, Inc. today announced a next-generation powerline communication (PLC) device, the QCA7006AQ, designed to address the needs for electric vehicle (EV) charging station communications also known as electric vehicle supply equipment (EVSE) that use global Combined Charging System (CCS). The PLC device is based on Qualcomm Technologies’ market proven QCA700X family of products, which have been widely adopted in EV on-board charging units and charging stations across the globe. The QCA7006AQ is compliant with the HomePlug Green PHY (HPGP) specification, which is the leading specification for implementing Vehicle-to-Grid (V2G) systems.
Smart-grid integration allows vehicles to seamlessly authenticate on the network through Plug and Charge automated payments for EV charging, coordinating the timing and direction of energy to and from the grid and home. Smart-grid charging applications supported by the CCS standard allows users the flexibility to choose optimal charging times and extract energy from their EVs as needed, supporting the growing need for EV charging while minimizing peak load power generation and distribution requirements.
This is Qualcomm Technologies’ first QCA700X PLC device designed to support an Ethernet digital interface and that is qualified to support an ambient operating temperature range of -40°C to +105°C (AEC-Q100 Automotive Grade 2). As an optional feature, the QCA7006AQ also supports HomePlug Audio Video (HPAV) streaming at PHY rate exceeding 200 Mbps, allowing EV customers an alternate wired data connection to the cloud through the charging station. The introduction of the Ethernet digital interface, in addition to Serial Peripheral Interface (SPI), the AEC-Q100 Grade 2 compliance, and the HPAV operation mode, supports expanded design flexibility for future devices.
“By further expanding our PLC device portfolio, in addition to engineering the fully integrated, scalable Snapdragon Digital Chassis solution for automakers, Qualcomm Technologies is supporting an evolving automotive industry driven by the EV vehicle architecture,” said Lars Boeryd, Sr. Director Product Marketing, Automotive at Qualcomm Technologies, Inc. “As a leading supplier of PLC HPGP devices for smart-grid communications, we are committed to helping our customers succeed in a growing EV industry increasingly adopting the CCS standard.”
The QCA7006AQ is planned to be available for production by early Q4 2022, and samples are available today. Additional information can be found here.
Qualcomm (qualcomm.com) is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research, and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.
QCA7006AQ and the Snapdragon Digital Chassis are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
Contact: Mauricio Lopez-Hodoyan - Investor Relations
P: 858-658-4813 - E: ir[.]qualcomm.com.