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The combined solution offers cloud to IoT authentication and security, secured connectivity and IoT device privacy.
Winbond, a leading global supplier of semiconductor memory solutions and secure memories, is displaying at electronica (Munich, Germany, 13-16 November 2018) a set of solutions to the embedded memory constraints facing designers of security-critical applications in IoT nodes and other connected products.
Winbond’s W75F Secure Flash Solution is the first secure Flash memory device to gain a Common Criteria (CC) EAL5+ certificate. It can be used for secure Execute-in-Place (XiP) functions, and to protect the confidentiality and integrity of code and data in IoT devices, and in integrated UICC, integrated Secure Element or integrated Hardware Security Modules (HSM) for automotive and Artificial Intelligence (AI) platforms.
The Winbond W75 provides the industry’s most secure external storage for data and code. It offers a dependable solution for manufacturers of connected devices which want to defend their products against threats such as replay, roll-back, man-in-the-middle, sniffing, side channel and fault injection attacks.
Tiempo Secure’s TESIC is a unique family of Common Criteria EAL5+ certification proven Secure Element IPs designed for the IoT, available for SoC/chip integration as hard IP macros. TESIC IP being already integrated into its CC EAL5+ and EMVCo certified secure microcontroller chip, Tiempo Secure is uniquely able to offer such CC EAL5+ security proven IP solution as well as a guaranteed path from IP integration to CC EAL5+ certification. Tiempo Secure provides Customers with a one-stop shop security solution, including secure hardware design and secure software development services that complement its TESIC IP portfolio, and the execution and support of CC EAL5+ and EMVCo certification processes for Customers’ chips including Tiempo Secure’s hard IP macros.
Hung-Wei Chen, Director of Winbond Secure Flash Memory Marketing, said: “We believe that non-secure IoT devices pose a severe cyber-threat that must be addressed by securing the flash memory used for the storage of data, code, and credentials in all connected devices. Due to the ever-growing complexity, flash memory density requirements are growing as well, forcing a move to external, larger, secure flash memories that are addressed by Winbond’s TrustME™ family. We are pleased to have Tiempo Secure work with us to take this a step further, providing a robust and certifiable Secure Element IP and certified secure flash for the age of IoT”
Serge Maginot, CEO and President of Tiempo Secure, said: “We strongly believe that hardware security, embedded into the edge devices, is the best solution to efficiently protect the IoT system against selective or expert attacks. We are particularly excited to extend our security one-stop shop model and secure IP family with Secure Elements that will be including a ready to use and proven secure communication channel to Winbond’s Secure Flash chips, enabling end to end security between application chip and flash memory chip at CC EAL5+ grade. This partnership between Winbond and Tiempo is now empowering IoT developers and users to address the two critical challenges on the road for IoT deployment, i.e., easy connectivity and high level of security.’”
About Winbond
Winbond Electronics Corporation (winbond.com) is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2017 about US$1.25 billion. Winbond has approximately 2,800 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA.
About Tiempo Secure
Tiempo Secure (tiempo-secure.com) is an independent company founded by semiconductor industry experts having unique experience in the development of secure microcontrollers and embedded secure software. The company has already designed Common Criteria EAL5+ and EMVCo certified secure microcontroller chips, available in contact and dual interface mode, for Government ID and High-end Banking applications Tiempo Secure is expanding its roadmap by offering CC EAL5+ proven/certified Secure Elements for the IoT market, either as companion chip or as hard IP macros that are easy to integrate into application/SoC chips.
Winbond Contacts
Product Contact
Hung-Wei Chen, Secure Flash Memory Marketing Director
T: +886-3-5678168 x75310 - E: hwchen8[.]winbond.com.
News Contact
Yulia Lee, Digital Marketing Manager
T: +886-3-5678168 x75395 - E: ylli5[.]winbond.com.
Press Contact
Tracy Annandale, TKO Marketing Consultants Ltd
T: +44(0)14 4447 3555 - E: tracy[.]tko.co.uk.
Spokesperson
Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
T: +886-3-5678168 /+886-987-365682
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axel.vonderhagen[.]tiempo-secure.com 
