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NewswireTODAY - /newswire/ -
Munich, Germany, 2015/03/03 - Infineon Technologies AG announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge - Infineon.com. FSE: IFX; OTCQX: IFNNY
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Infineon’s SLE 97 is a SOLID FLASH™-based eSE chip which can safeguard the functionalities of the mobile device as well as transactions where users’ sensitive data such as payment credentials are concerned.
“We are proud that the SLE 97 has been selected by our customer Oberthur Technologies to secure Samsung’s new flagship smartphones Galaxy S6 and S6 edge,” says Stefan Hofschen, President of the Chip Card & Security Segment of Infineon Technologies. “Our embedded Secure Element chips can protect the device as well as user data and are therefore essential for a seamless and secure customer experience in an increasingly connected world.”
The Samsung Galaxy S6 and S6 edge are Samsung’s new premium smartphones introduced at the “Unpacked 2015” in Barcelona.
Infineon at Mobile World Congress
Infineon will exhibit its comprehensive portfolio for performance and security in the connected world at the Mobile World Congress 2015 in Barcelona, Spain (Hall 6, Booth 6B62).
About Infineon
Infineon Technologies AG (infineon.com) is a world leader in semiconductors. Infineon offers products and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2014 fiscal year (ending September 30), the company reported sales of Euro 4.3 billion with about 29,800 employees worldwide. In January 2015, Infineon acquired US-based International Rectifier Corporation, a leading provider of power management technology, with revenues of USD 1.1 billion (fiscal year 2014 ending June 29) and approximately 4,200 employees.
Information Number: INFCCS201503-040
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Agency / Source: Infineon Technologies AG
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Infineon’s SLE 97
| Mobile World Congress |
Contact: Karin Braeckle - Infineon.com
+49 89 23423424  karin.braeckle[.]infineon.com
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