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S-Bond Technologies Teams Up with Formula 1 High Performance Automobiles - S-Bond Technologies is now being used by Mercedes Benz for its thermal management components
S-Bond Technologies Teams Up with Formula 1 High Performance Automobiles

 

NewswireToday - /newswire/ - Doylestown, PA, United States, 2010/09/17 - S-Bond Technologies is now being used by Mercedes Benz for its thermal management components.

   
 
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S-Bond Technologies has been adopted by Mercedes Benz High Performance Engines (MBHPE) for use in thermal management components for its Kinetic Energy Recovery System (KERS) in its Formula 1 race cars. S-Bond is joining aluminum fin to aluminum bases that attach to and cool the electric drive's electrical power conversion modules. The heat transfer interfaces provided by S-Bond were 98% void free and yielded excellent thermal cooling performance.

S-Bond Technologies, LLC (s-bond.com) was spun out of Materials Resources International in 2004 to commercialize its active solder technology. Since then S-Bond Technologies (SBT) has consistently grown as applications for S-Bond joining has grown. MRi and S-Bond Technologies were started and are led by Dr. Ronald Smith who has spent 10 years at GE Gas Turbine and GE Aircraft Engine, then spent 10 years at Drexel University as a Research Professor before starting MRi and SBT. In order to increase its manufacturing capabilities, SBT added Mr. Gabe Sulyok as its Manufacturing Operations Manager. He brings over 25 years of operations and industrial engineering experience to enhance the facilityís manufacturing capabilities and support our customersí production needs.

S-Bond Technology's products are used today in thermal management systems, sensor assemblies, electronics, and a host of other applications where good bond strength, high thermal and electrical conductivity, and a reduced environmental impact are important.

 
 
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S-Bond Technologies Teams Up with Formula 1 High Performance Automobiles

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