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SENKO Advanced Components, Inc. Introduces S-123 High Temperature Epoxy
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NewswireToday - /newswire/ -
Marlborough, MA, United States, 10/06/2009 - Senko S-123 Epoxy is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.
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The S-123 Epoxy is a low viscosity mixture that ensures exceptional wicking and wetting of the fibers, along with superior adhesion strength. Uses include bonding fiber optic bundles, potting glass fiber bundles and termination of single mode and multi mode fiber optic connectors. Available in 2.5 grams bi-packs.
Technical Data
Color: Resin, amber - Hardener, amber - Mixed, dark amber
Specific Gravity: 1.20
Refractive index: 1.56
Operating Temperature: -60°C to +175°C
Working life: 4h
Glass Transition Temperature: 120°
Cure Schedule
Temperature: 100°C 120°C
Time: 5 minutes 2 minutes
Features
Low Viscosity
Extended working life
GR-326* Compliant
Rapid Heat Curing in 2 minutes at 120°C
Competitive pricing
Suitable for outside plant applications, temperatures -40° to +85°C
Applications
Fiber Optic Termination
Bonding fiber optic bundles
Local Area Networks (LANs)
Potting glass fiber bundles
SENKO Advanced Components, Inc. (senko.com) is a recognized leader in the design, production, sales, marketing, and distribution of over 1000 fiber optic products including; splitters, WDM’s, couplers, protection tubing, and cleaning and inspection equipment. An ISO-9001 approved company, SENKO is able to provide multinational corporations with the technical expertise to liaise with engineers, and the manufacturing flexibility to develop custom products for the ever growing high tech industry.
Many of our products were created to resolve a specific design challenge faced by our customers. We offer one of the industry’s largest product portfolios, and our quality is second to none.
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Agency / Source: SENKO Advanced Components
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Availability: All Regions (Including Int'l)
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Contact: Sarah Norton
858-623-3300 news[.]senko.com
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IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any SENKO Advanced Components securities in any jurisdiction including any other companies listed or named in this release. |
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