PRTODAY / NewswireToday Free press release distribution service network

Written by / Agency / Source: The Simon Group, Inc.

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Aries Electronics Announces Adjustable Pressure Pad on its New CSP Test Socket - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad
Aries Electronics Announces Adjustable Pressure Pad on its New CSP Test Socket

 

NewswireToday - /newswire/ - Bristol, PA, United States, 2009/05/01 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

With only a 0.010 inch (0.254 mm) displacement per revolution of the screw, the finest adjusting resolution of any test socket on the market, this mechanism makes the sockets ideal for testing very small, fragile devices, such as thin or ceramic chips, without causing damage, and devices with large height tolerances.

Users can back off the adjusting screw and close the socket’s lid securely with one finger and very little force, and then modify the pressure pad force with the adjusting screw after the lid is closed to ensure good contact. The screw can also be adjusted based on device height from chip to chip eliminating socket rework downtime to design a new pressure pad.

Each adjustable pressure pad comes with an easily modified, user-adjustable washer stack in 0.001 inch (0.0265 mm) and 0.010 inch (0.254 mm) increments that serves as a hard stop to eliminate device over-compression. If constant large device height changes are expected during testing, the washer stack can be removed without affecting the socket’s performance.

With a signal path of only 0.077 inches (1.96 mm), the new sockets provide minimal signal loss for higher bandwidth capability. The sockets’ relatively low cost and small overall size allow the maximum number of sockets per BIB (burn-in board) and BIBs per oven, while remaining operator friendly.

Aries’ latest sockets use solderless pressure mount compression spring probes accurately located by two molded plastic alignment pins and mounted with stainless steel screws.

The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability. Probes are constructed of heat-treated beryllium-copper with a minimum of 30 micro inches (0.75 micro mm) gold per MIL-G-45204 over a minimum of 30 micro inches (0.75 micro mm) nickel per SAE-AMS-QQ-N-290 plating.

Contact forces are 15 g per contact on a 0.30 mm to 0.35 mm pitch; 16 g per contact on a 0.40 mm to 0.45 mm pitch and 25 g per contact on pitches of 0.50 mm or larger. Operating temperature is -55°C to +150°C (-67°F to +302°F) and estimated contact life is a minimum of 500,000 cycles.

Molded socket components are Ultem. Machined socket components (if required) are PEEK or Torlon. Hardware is stainless steel.

As with all Aries sockets, the new CSP/MicroBGA test and burn-in sockets are available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing is an additional $60 per pad for this optional feature on socket quantities of 50 or more. Delivery is four to six ARO.

For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; T: 215-781-9956; F: 215-781-9845; E: info[.]arieselec.com; Europe E: europe[.]arieselec.com.

Subscribe to Aries’ RSS feed.

Reader Service Inquiries: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.

Upcoming Tradeshow: Semicon West; Booth #7243 West Hall Level 1; July 14-16, 2009; San Francisco, CA

Headquartered in Bristol, Pa., Aries Electronics Inc. (arieselec.com), manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip™ product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: The Simon Group, Inc.

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Electronics/Instrumentation/RFID articles,
CATCH Visitors via Your Competitors Announcements!


Aries Electronics Announces Adjustable Pressure Pad on its New CSP Test Socket

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

|
Publisher Contact: Beth Smith 
215-453-8700 publicrelations[.]simongroup.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any The Simon Group, Inc. securities in any jurisdiction including any other companies listed or named in this release.

Electronics/Instrumentation/RFID via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From The Simon Group, Inc. / Company Profile


Read Electronics/Instrumentation/RFID Most Recent Related Newswires:

Mentor Graphics Receives Electronic Products 2016 Product of the Year Award for Tessent DefectSim
Sensorex Water Sensors Chosen for Innovative Smart Village Concept
Elmo Expands Production in The EU
Cobham Voltage Regulators On Board GOES-R Satellite’s EXIS Instrument
Spellman to Exhibit at NDTMA 2017 Spring Conference in Las Vegas, Nevada
Detego Showcases New IoT and AI Solutions for Retailers At NRF London
Frost & Sullivan Lauds Keysight’s Success in Developing a Broad T&M Product Portfolio to Fast-track IoT Product Deployment
Tiempo Secure TESIC-SC Obtains CC EAL 5+ and EMVCo Certifications
Curtiss-Wright Debuts Next Generation Quad-Core Power Architecture® Single Board Computer
Detego Announces Partnership with French RFID Systems Integrator IER
ASUS Relies on Infineon REAL3™ Image Sensor Chip to Bring Augmented Reality into Compact Smartphones
Bruker Announces Acquisition of SCiLS GmbH to Advance MALDI Imaging Software Solutions for Life Science, Pharma and Pathology Research Applications
Bruker Announces Acquisition of CMO InVivo Biotech to Expand Molecular Biology, Microbiology and Pathology Consumables and Assay Business
Cobham Electronics Launch Aboard NASA CYGNSS
Curtiss-Wright Supports New 7th Gen Intel® Xeon® Processors on DO-254 Safety Certifiable Single Board Computers

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  Intrinsic Executive Search Ltd

Visit  NAKIVO, Inc.





 
  ©2017 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)