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Written by / Agency / Source: Robson Technologies, Inc.

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Robson Technologies, Inc. Develops Modular Platform Test Sockets for BGA Devices - multiple BGA packages of similar pitch and ball size can be tested using one test socket, greatly reducing product inventory and lowering cost of test - Testfixtures.com
Robson Technologies, Inc. Develops Modular Platform Test Sockets for BGA Devices

 

NewswireToday - /newswire/ - Morgan Hill, CA, United States, 2009/04/30 - multiple BGA packages of similar pitch and ball size can be tested using one test socket, greatly reducing product inventory and lowering cost of test - Testfixtures.com.

   
 
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The term ‘one size fits most’ is a good way to describe the new family of universal BGA test sockets developed by Robson Technologies, Inc. (RTI). Like other BGA sockets, the 900-1184, 900-1188, and 900-1189 sockets are drilled to various array sizes for a specific pitch. However, aluminum alignment plates allow any BGA package of the same pitch, up to the maximum array size, to be used in the same socket base while keeping the position of pin A1 as a constant.

RTI designed the universal BGA sockets to meet growing market needs and answer multiple customer requests; “reduce product inventory and lower cost of test.” These universal sockets are designed primarily for failure analysis and engineering testing and allow for quick exchange of packages with an optional adjustable clip-on lid. Although RTI has been designing sockets using an interchangeable alignment plate concept for over five years, it wasn’t until very recently that the design was modified to allow pin A1 to remain in the same position regardless of the package size. This is achieved by placing the package in alignment to the upper left-most corner of the array, rather than the center.

The consistency of pin A1’s location allows for the consistency of other factors between package and tester. Because each of these sockets use the same footprint with pin A1 in the same physical location relative to the alignment pins of the socket, they can be mounted on RTI’s universal or customer designed daughter cards to interface with test equipment, including RTI’s Curve Trace Automated DC Parametric test systems. Standard placement also prevents the need to reestablish a new netlist as the package size changes. Now that one socket is capable of testing an entire family of BGA parts Consumers will see an immediate drop in the size of their DUT and socket inventory, and test equipment expenses.

Contingent on package pitch, standard contacts are rated at 1amp minimum and are available for high frequency testing. The sockets and contacts are rated for well over 100,000 cycles. RTI also offers compatible heated and cooled lids for failure analysis and engineering purposes.

RTI (testfixtures.com) specializes in the design and manufacturing of test fixtures in support of failure analysis and production test environments. RTI’s growing product line includes standard and specialty sockets, lids, and test fixtures. RTI develops solutions for topside and backside package analysis as well as temperature controlled sockets for analysis and product engineering applications. RTI’s test fixtures include standard interfaces to most production and diagnostic test systems as well as custom designs for specialty test systems. With the acquisition of Ultra Test International (UTI) in July of 2008, RTI now offers curve tracing and auto tracing DC Parametric test systems.

 
 
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Written by / Agency / Source: Robson Technologies, Inc.

 
 

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Robson Technologies, Inc. Develops Modular Platform Test Sockets for BGA Devices

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Publisher Contact: Aaron Petray - Testfixtures.com 
408-227-8008 rti[.]testfixtures.com
 
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