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Radiation Assured Devices Offers Service to Perform Backside Thinning on ICs to 50uM of Die Surface - Radiation Assured Devices has completed process development to perform backside thinning on ICs within 50-microns of the topside of a die. This technique has proven itself extremely valuable in preparing ICs for Single Event Effects (SEE) testing
Radiation Assured Devices Offers Service to Perform Backside Thinning on ICs to 50uM of Die Surface

 

NewswireToday - /newswire/ - Colorado Springs, CO, United States, 2009/04/16 - Radiation Assured Devices has completed process development to perform backside thinning on ICs within 50-microns of the topside of a die. This technique has proven itself extremely valuable in preparing ICs for Single Event Effects (SEE) testing.

   
 
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Radiation Assured Devices (RAD) has completed development of a production process to perform backside thinning on Integrated Circuits (ICs) within 50-microns of the topside of a die. This technique has proven itself extremely valuable in preparing memory, FPGA and Application Specific Integrated Circuits (ASICs) for failure analysis and heavy ion Single Event Effects (SEE) testing.

“Certain devices require backside irradiation for heavy ion testing, such as Double Data Rate Synchronous Dynamic Random Access Memory (DDR SDRAM) which has a top-side lead frame and a flip-chip packaging configuration. The more material that can be removed the more options that become available when performing single event effects (SEE) or soft error rate (SER) testing,” said Joseph M. Benedetto Ph.D., CTO of Radiation Assured Devices.

“We are very pleased to offer this service to our spaceborne electronics customers in order to assist them with their own internal heavy ion Single Events Effects testing," said Chris Barton, CEO of Radiation Assured Devices. “We perform SEE testing for a large number of customers and this technique has proven highly valuable to us. We look forward to pushing the capability of this process and offering a die thinning service to our customers within 25-microns of the topside die surface in the future. This is the next step in our roadmap.”

For more information or for a quotation, please contact Charlie Beebout at either 719-531-0800 x113.

About Radiation Assured Devices (RAD)
Radiation Assured Devices, Inc. (radiationassureddevices.com) uses commercial and specialty technologies to provide state of the art radiation engineering and qualification services as well as radiation hardened products for commercial and military spaceborne electronics with the highest levels of reliability and radiation assurance. RAD is ISO 9001:2000 certified. RAD was recently named the first and only private sector, commercial laboratory to obtain lab suitability for performing Total Ionizing Dose (TID) testing to the MIL-STD-750 TM 1019 requirement.

RAD’s current irradiation capabilities include: Two Cobalt-60 sources, Cesium-137 source, 14MeV Neutron Generator, 1E11 rad/s Flash X-Ray/Prompt Dose Testing; Total Dose (TID) Testing; Enhanced Low Dose Radiation Sensitivity (ELDRS) Testing; Heavy Ion Single Event Effects (SEE) Testing including Single Event Latch-up (SEL), Singe Event Upset (SEU), Single Event Transient (SET), Soft Error Rate (SER) and Single Event Functional Interrupt (SEFI); Radiation Lot Acceptance Testing (RLAT); Focal Plane Array (FPA) or Sensor Chip Array (SCA) Radiation, Characterization and Testing; Radiation Engineering and Component Qualification Planning; Wafer Lot Radiation Screening, Characterization, and Qualification; Mil-Std Screening and Qualification of Advanced COTS Devices as well as Design Engineering for Radiation Hardened Devices.

RAD also offers the following support services: Quick-Turn Low-Cost $500 Prototype IC Assembly; Backside Die Thinning to a 50uM Thickness and/or Re-assembly for Heavy Ion Radiation testing; Chip Removal and Re-assembly for Heavy Ion Radiation testing; PC Board Design, Laser marking and Laser cutting.

It is the vision and mission of RAD to be the company of choice for radiation testing for devices, systems and materials as well as related engineering services.

Founded in 2003, Radiation Assured Devices is privately held and based in Colorado Springs, CO. For more information visit our website.

© 2009 Radiation Assured Devices. All rights reserved. Trademarks and brands are the property of their respective owners.

 
 
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Written by / Agency / Source: Radiation Assured Devices, Inc.

 
 

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Radiation Assured Devices Offers Service to Perform Backside Thinning on ICs to 50uM of Die Surface

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Radiation Assured Devices |
Publisher Contact: Charlie Beebout - RadiationAssuredDevices.com 
719-237-0990 cbeebout[.]radiationassureddevices.com
 
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