The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.
With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.
“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyamides.”
Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.
Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.
“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”
Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.
Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.
Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.
Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
About Endicott Interconnect Technologies, Inc.
Endicott (eitny.com) is a leading provider of high-performance electronics packaging and complex assembly solutions to a wide range of electronic equipment OEMs such as: IBM, Sun Microsystems, Cadence Design Systems, Cisco Systems, Inc., The Boeing Company, and Raytheon Company. Endicott is the successor to IBM’s micro-electronics division in Endicott, NY and was incorporated in 2002. The company provides a broad range of products and services, including semiconductor packaging, printed circuit boards and complex assembly solutions. For more information, contact Theresa Taro, Director of Marketing & Communications, at 607-755-1847 or therese.taro[.]eitny.com.
About Frost & Sullivan
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