PRTODAY / NewswireToday Free press release distribution service network

Written by / Agency / Source: Frost & Sullivan

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

3D Packaging Technologies Evolve in Response to Miniaturization of Electronic Devices and Applications - Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry. Its performance promises to drive efforts across the entire supply chain to successfully deploy it
3D Packaging Technologies Evolve in Response to Miniaturization of Electronic Devices and Applications

 

NewswireToday - /newswire/ - Palo Alto, CA, United States, 2008/04/24 - Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry. Its performance promises to drive efforts across the entire supply chain to successfully deploy it.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

New analysis from Frost & Sullivan (technicalinsights.frost.com), Global Trends in Electronic/Chip Packaging, finds that 3D packaging technology will be key in catering to the ever-increasing miniaturization demands from application sectors that include consumer electronics, game consoles, and a wide range of high-speed memory devices. Looking beyond successful solutions such as system on chip (SoC), the electronic/chip packaging industry has steadily started exploring various forms of system in package (SiP)-based solutions.

Currently, the industry focuses on interconnect technologies, signal integrity issues, and manufacturing capabilities. Resolving all challenges with regards to 3D system design remains very important to drive this technology efficiently across the supply chain.

"Advances in the field of packaging technologies are taking the package closer to the bottom-line wafer," notes Frost & Sullivan Technical Insights Research Analyst Krishnakumar Srinivasan. "A close look into the latest packaging solutions such as 3D packaging will show that packaging technologies have advanced to such an extent that they share a dominant role in maintaining advances in the semiconductor industry along the Moore curve."

The demands of the consumer electronics industry remains the most influential driver for technological advances in the semiconductor industry. Moore's curve identifies growth patterns in the electronics industry and any indication that further development along this curve would be difficult, but would spur innovation in the industry. Electronic packaging increasingly supports miniaturization. All along the growth curve of packaging technologies, the packaging module has subtly moved a step closer to the wafer. With advances in technologies such as SiP, SoC, and Wafer Level Packaging (WLP), the package and wafer have become merged entities of an integrated chip.

However, there remain a few critical challenges that restrain the pace of development efforts around the globe. The industry needs to focus on the development of efficient design tools for 3D system design. Advances in interconnect technologies, bonding technologies, and manufacturing equipment remain key areas that require development focus in this demanding space.

"Thinking in 3D is the most critical aspect of the evolution of 3D packaging solutions," says Srinivasan. "While there are some demonstrations around the globe in 3D packages, most of these efforts are restrained due to the lack of proper 3D design tools."

Despite all this, developers of advanced packaging technologies are successfully taking the technology forward. The most successful efforts result from the establishment of very clear in-house rules and standards that guide development. Beyond this, most developers understand the need to address manufacturing and deployment issues at an early stage of development.

A proper level of knowledge sharing through consortiums, for example, will enable the establishment of successful standards for contribution across the entire supply chain. Such efforts will highlight the technology needs to be addressed at each stage of the supply chain and accelerate the evolution of advanced packaging technologies.

Global Trends in Electronic/Chip Packaging, a part of the Technical Insights program, provides a technology overview and outlook for electronic/chip packaging. The study covers some of the latest trends in emerging packaging technologies with a focus on 3D Packaging. Furthermore, this research service includes detailed technology analysis and industry trends evaluated following extensive interviews with market participants. Interviews with the press are available.

If you are interested in an analysis, which provides manufacturers, end users, and other industry participants with an overview, summary, challenges, and latest coverage of global trends in Electronic/Chip Packaging, send an email to David Escalante, Corporate Communications, at descalante_ti[.]frost.com with your full name, company name, title, telephone number, company email address, company website, city, state and country. Upon receipt of the above information, an overview will be sent to you by email.

Technical Insights is an international technology analysis business that produces a variety of technical news alerts, newsletters, and research services.

Frost & Sullivan, the Global Growth Consulting Company, partners with clients to accelerate their growth. The company's Growth Partnership Services, Growth Consulting, and Career Best Practices empower clients to create a growth-focused culture that generates, evaluates, and implements effective growth strategies. Frost & Sullivan employs over 45 years of experience in partnering with Global 1000 companies, emerging businesses, and the investment community from more than 30 offices on six continents.

Global Trends in Electronic/Chip Packaging D0C1

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Frost & Sullivan

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+] / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Electronics/Instrumentation/RFID articles,
CATCH Visitors via Your Competitors Announcements!


3D Packaging Technologies Evolve in Response to Miniaturization of Electronic Devices and Applications

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

Frost & Sullivan |
Publisher Contact: David Escalante 
210.477.8427 david.escalante[.]frost.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Frost & Sullivan securities in any jurisdiction including any other companies listed or named in this release.

Electronics/Instrumentation/RFID via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Frost & Sullivan / Company Profile


Read Electronics/Instrumentation/RFID Most Recent Related Newswires:

Imec Develops 3D-Compatible Germanium nMOS Gate stack with High Mobility and Superior Reliability
Curtiss-Wright to Expand Position in Data Acquisition & FTI Markets with Acquisition of Teletronics Technology Corporation
Datalogic Receives Top Honor At Inspect Awards 2017
Leonardo Sees Surge in Export Orders for Man-portable Laser Designators from US and Europe
Imec Demonstrates World’s First Vertically Stacked Gate-all-Around Si Nanowire CMOS Transistors
GE Ventures, Microsemi and Corning Partner to Launch Menlo Micro and Next Generation of Electronic Switching
Frost & Sullivan Commends LeEco for Driving Innovation in the North American Smart Technologies Market
Malvern Instruments and PANalytical to Merge
Bruker Announces Corporate Partnership with International Phenome Centre Network (IPCN) for NMR Technologies and SOPs
Predictive and Control Capabilities through IoT Rapidly Expand Global Growth Opportunities for Sensors Finds Frost & Sullivan
IDEX Showcased the World’s First Flexible Touch Fingerprint Sensor for SmartCards and Receives Massive Industry Interest
Endress+Hauser Consult AG Introduces Proline 300/500 - Flow Measuring Technology for the Future
Lipigas Delivers Enhanced Interactive and Visual Mobile Self-Service Portal Using Joint Visual IVR Solution from Dialogic and Telectronic
Customized Electronic Ticket Solutions Simplify Daily Commute in Russian Cities
Bruker AXS Introduces A New Member to The D8 ADVANCE Family - The D8 ADVANCE Plus™

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  BizJobs.com

Visit  JobsWare.com





 
  ©2016 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)