PRTODAY / NewswireToday Free press release distribution service network

Written by / Agency / Source: Electronics.ca Publications

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

The Compound Semiconductor Substrate Business will Break the Billion Dollar Barrier by 2009 - For more than 20 years, silicon pure players have been looking at those
The Compound Semiconductor Substrate Business will Break the Billion Dollar Barrier by 2009

 

NewswireToday - /newswire/ - Montréal, Québec, Canada, 2008/04/08 - For more than 20 years, silicon pure players have been looking at those "strange" semiconductor materials made of a compound of 2 or more metals, wondering if it could be, one day, a threat for their existing business.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new report entitled "Compound Semiconductor Materials Market".

For more than 20 years, silicon pure players have been looking at those "strange" semiconductor materials made of a compound of 2 or more metals, wondering if it could be, one day, a threat for their existing business. Material makers are seeking new business opportunities outside of silicon and equipment suppliers are open to adapt their know-how and expand their product portfolio.

Silicon largely dominates the semiconductor business as the reference material. However, specific applications such as optoelectronics, RF or power electronics require material properties that cannot be offered by silicon.

According to the new study, GaN, GaAs, InP, SiC and Sapphire substrates now account for only 0.6% of the 8,630 million square inches annually processed in semicon fabs. However, that small portion of processed area is compensated by a higher merchant price leading to a $800M market size in 2007, reaching the billion dollar threshold by 2009- 2010.

Up to now, these materials have been protected from silicon competition, allowing device performance not reachable by the semiconductor material, such as Frequency, power, thermal conductivity, robustness, junction temperature and voltage breakdown. However, compound materials exhibit market prices dramatically higher than Si.

This situation, the report explains, pushes the device developers to do "as well as" the compounds but using silicon. Bill Of Material is the main market driver for the adoption of these CS substrates and related technologies, and is predicted to remain in the future.

This new report offers a unique panorama of the compound semiconductor material business in a single package. It highlights the main metrics and the key market trends that will help material and equipment vendors to position their R&D efforts and anticipate the changes and forecasted evolution of their business.

Details of the new report can be found on Electronics.ca Publications' website.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Electronics.ca Publications

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Electronics/Instrumentation/RFID articles,
CATCH Visitors via Your Competitors Announcements!


The Compound Semiconductor Substrate Business will Break the Billion Dollar Barrier by 2009

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

|
Publisher Contact: Chiaki Sadanaga 
+1 514 907 2112 pr[.]electronics.ca
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Electronics.ca Publications securities in any jurisdiction including any other companies listed or named in this release.

Electronics/Instrumentation/RFID via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Electronics.ca Publications / Company Profile


Read Electronics/Instrumentation/RFID Most Recent Related Newswires:

Curtiss-Wright Selected by Bell Helicopter Canada to Provide Cockpit Voice/Flight Data Recorder System
Toyota Acknowledges Infineon for Outstanding Quality
Curtiss-Wright, Lynx Software Technologies, ENSCO Avionics, and CoreAVI Demo LynxOS®-178 Safety Certified RTOS for Single Board Computers
Hitachi High-Technologies Launches the Most Advanced Ion-Milling System ArBlade 5000
LORD Corporation Adds Low-Cost, Industrial-Grade 3DM-CV5 Inertial Sensor Family
Bruker Introduces New Calibrations for EOS Handheld LIBS Elemental Analyzer
Bruker Introduces New Clinical Microbiology Assays and Kits at ECCMID
Infineon Joins the 5G Automotive Association to Contribute to Connected Automated Driving
Voith Partners 2ith Persistent Systems, LLC to Offer Unique Radio Technology for Industrial Environments
Spellman High Voltage Electronics to Exhibit at the International Technical Exhibition of Medical Imaging 2017 (ITEM)
Curtiss-Wright Introduces Cost-Effective COTS-based Radiation-Tolerant Data Acquisition System for Space Based Applications
Tiempo Secure Introduces TESIC-SE Secure Element Associating High Security with Low Power for the IoT Market
Curtiss-Wright and WOLF Advanced Technology Collaborate to Bring Advanced NVIDIA Maxwell and Pascal GPGPU COTS Solutions to ISR/EW Applications
Signaling Continued Investment in China, Bruker Open Beijing Center of Excellence
Bluestar Introduces New ISV Connect Program

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  BizJobs.com

Visit  JobsWare.com





 
  ©2017 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)