| |
The reduced footprints of semiconductor packages have made accuracy imperative in chip bonder machines and this development fuels growth in the chip bonder market.
New analysis from Frost & Sullivan (smt.frost.com), World Chip Bonder Markets, finds that the market earned revenues of $908.7 million in 2006 and estimates earnings will reach $1.7 billion in 2013.
If you are interested in a virtual brochure, which provides manufacturers, end users, and other industry participants with an overview of the World Chip Bonder Markets, then send an email to David Escalante, Corporate Communications, at descalante_pr[.]frost.com, with your full name, company name, title, telephone number, email, address, city, state and country. Upon receipt of the above information, an overview will be sent to you by email.
In order to achieve higher precision, chip bonder equipment manufacturers will need to increase the capabilities of die handling. This will also ensure that additional steps in the packaging processes do not present assembly dilemmas for the equipment.
Technology trends such as stacked packages, system-in-package (SiP), package-on-package (PoP) and flip chip-in-package (FCiP) types will positively impact the advanced packaging equipment market. Integrated circuit (IC) developers and equipment manufacturers will derive cost effective solutions from these package types.
"With the high-volume manufacturing of semiconductor packages, these technology trends will help equipment manufacturers to provide robust solutions to end-users," says Frost & Sullivan Research Analyst Julian Harris. "The increased functionality and low overall packaging cost will offer adaptable solutions to both suppliers and customers."
However, chip bonder equipment manufacturers are beginning to feel the strain of finding a system solution for end users who will use smaller semiconductor packages in their electronic products. Customizations required by end users include specific bonding processes and additional machine capabilities such as hybrid applications.
"End users are demanding simple solutions from equipment suppliers to manufacture semiconductor packaging machines that incorporate numerous attachment applications, from epoxy-die bonding to high- and low-end flip chip applications," explains Harris. "Considering these different applications require different component settings, such as placement accuracy and die handling, equipment manufacturers are implementing manufacturing processes to decrease machine footprint."
Meanwhile, the handling of very thin die also poses a challenge to the machine components of chip bonder equipment. Suppliers must implement a strategy to modify machine capabilities in order to accommodate the requirements of package developers.
"For instance, machine components such as an optimal indexer will provide excellent handling, higher throughput, and increase the transfer rate of lead frames or thin substrates that complicate the die attach process," notes Harris. "With the incorporation of proper vision systems, the quality of pre- and post-bonding processes is expected to increase and save costs for end users."
World Chip Bonder Markets is part of the Surface Mount Technologies Growth Partnership Services program, which also includes research in the following markets: automatic identification, mechanical power transmission, sensors and instrumentation, and surface mount technologies. All research services included in subscriptions provide detailed market opportunities and industry trends that have been evaluated following extensive interviews with market participants. Interviews with the press are available.
Frost & Sullivan, the Global Growth Consulting Company, partners with clients to accelerate their growth. The company's Growth Partnership Services, Growth Consulting, and Career Best Practices empower clients to create a growth-focused culture that generates, evaluates, and implements effective growth strategies. Frost & Sullivan employs over 45 years of experience in partnering with Global 1000 companies, emerging businesses, and the investment community from more than 30 offices in six continents.
World Chip Bonder Markets - N243
|
david.escalante[.]frost.com 
