PRTODAY / NewswireToday Free press release distribution service network

More news: Software
Written by / Agency / Source: Report Buyer Ltd

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

New Report from ReportBuyer.com Highlights Increase in the Use of Wafer Level Packaging - Report Buyer has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end
New Report from ReportBuyer.com Highlights Increase in the Use of Wafer Level Packaging

 

NewswireToday - /newswire/ - London, United Kingdom, 2008/03/03 - Report Buyer has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Software Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Report Buyer, the online destination for business intelligence for major industry sectors, has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end.

According to “WLP & Embedded Die Technologies 2008” Wafer Level Packaging (WLP) is about to fill that gap by allowing the packaging and assembly steps to be performed at the wafer level.

The report shows that for CMOS imagers, WLP is already an industrial reality. Today, about 35% of CMOS imagers found in the latest cell-phone and notebook cameras are encapsulated in a WL-CSP. The report forecast that the technology could penetrate about 63% of this market by 2012 and should progressively spread from CIF/VGAs to higher resolution image sensors.

The report shows that as wafer sizes increase, the cost of packaging will decrease, even in the most stringent semiconductor applications.

As a generic description, WLP should be defined as “all packaging and assembly processes done at the wafer level, the last step being the chip dicing”. Subsequently, WLP does not require any intermediate substrate interposer: wafer level packaged components are directly “surface mountable” onto the circuit board. WLP represents a breakthrough technology to be implemented even in the most cost sensitive applications as it will scale favourably with the trend to manufacture on ever increasing wafer diameters.

The report will provide precise descriptions of the different types of devices using WLP and their related manufacturing challenges as well as market information.

“WLP & Embedded Die Technologies 2008” is available from Report Buyer. For more information, see website.

Report Buyer product ID: YOL00060

About Report Buyer
Report Buyer (reportbuyer.com) is a UK-based independent online store supplying business information. The website now carries over 44,000 business information products, including market reports, studies, books and events. Subscribers receive a free monthly newsletter and email alerts on new titles in their areas of interest. A regularly updated blog provides information on the latest market trends.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Software Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Report Buyer Ltd

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+]

 
 
# # #
 
Software Warnings - IMPORTANT:
Always be aware/cautious about what you download on your computer/mobile! PURCHASE SOFTWARE related keywords / Banner Ads. Click HERE for details!
.

 
  Your Banner Ad showing on ALL
Software articles,
CATCH Visitors via Your Competitors Announcements!


New Report from ReportBuyer.com Highlights Increase in the Use of Wafer Level Packaging

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

|
Publisher Contact: Jonna Dagliden 
+44 (0) 20 7060 7474 press[.]reportbuyer.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Report Buyer Ltd securities in any jurisdiction including any other companies listed or named in this release.

Software via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Report Buyer Ltd / Company Profile


Read Software Most Recent Related Newswires:

Infor Achieves FedRAMP Ready Status
Cortland Capital Market Services, LLC Adopts Yardi Investment Management
JDRF and IBM Collaborate to Research Risk Factors for Type 1 Diabetes in Children
MasterControl Unveils New Corporate Headquarters
MyoKardia Reduces VM Backup Budget by 50% with NAKIVO
The Weather Company, an IBM Business, to Integrate Global Flight Tracking Data from FlightAware
ROLI Harmonizes its Global Business with NetSuite OneWorld
Independent Research Firm Recognizes Hexaware as A Strong Performer in Continuous Testing Providers’ Evaluation
Airbus Selects OneLogin
Higher Education Institutions Select Oracle EPM Cloud to Drive Student Success
Splunk Introduces Splunk Insights for AWS Cloud Monitoring
HSBC and IBM Develop Cognitive Intelligence Solution to Digitise Global Trade
New Absolute 7 Platform Extends Endpoint Visibility and Control, Enabling Enterprises to See, Manage and Secure Every Endpoint, Everywhere
Sony and Sony Global Education Develop a New System to Manage Students' Learning Data, Built on IBM Blockchain
Oracle Empowers Organizations to Meet Accelerating Market Changes with Major Innovations to Supply Chain Management Cloud

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  S&A Capital Partner Ltd

Visit  La Bella Bakery Artisan Bakery Arizona





 
  ©2017 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)