PRTODAY / NewswireToday Free press release distribution service network

More news: Software
Written by / Agency / Source: Report Buyer Ltd

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

New Report from ReportBuyer.com Highlights Increase in the Use of Wafer Level Packaging - Report Buyer has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end
New Report from ReportBuyer.com Highlights Increase in the Use of Wafer Level Packaging

 

NewswireToday - /newswire/ - London, United Kingdom, 2008/03/03 - Report Buyer has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Software Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Report Buyer, the online destination for business intelligence for major industry sectors, has added a new report showing that the improvements of chip density versus cost in the semi-conductor industry have created a substantial gap between the scaling of the chip front end and the packaging assembly at the back end.

According to “WLP & Embedded Die Technologies 2008” Wafer Level Packaging (WLP) is about to fill that gap by allowing the packaging and assembly steps to be performed at the wafer level.

The report shows that for CMOS imagers, WLP is already an industrial reality. Today, about 35% of CMOS imagers found in the latest cell-phone and notebook cameras are encapsulated in a WL-CSP. The report forecast that the technology could penetrate about 63% of this market by 2012 and should progressively spread from CIF/VGAs to higher resolution image sensors.

The report shows that as wafer sizes increase, the cost of packaging will decrease, even in the most stringent semiconductor applications.

As a generic description, WLP should be defined as “all packaging and assembly processes done at the wafer level, the last step being the chip dicing”. Subsequently, WLP does not require any intermediate substrate interposer: wafer level packaged components are directly “surface mountable” onto the circuit board. WLP represents a breakthrough technology to be implemented even in the most cost sensitive applications as it will scale favourably with the trend to manufacture on ever increasing wafer diameters.

The report will provide precise descriptions of the different types of devices using WLP and their related manufacturing challenges as well as market information.

“WLP & Embedded Die Technologies 2008” is available from Report Buyer. For more information, see website.

Report Buyer product ID: YOL00060

About Report Buyer
Report Buyer (reportbuyer.com) is a UK-based independent online store supplying business information. The website now carries over 44,000 business information products, including market reports, studies, books and events. Subscribers receive a free monthly newsletter and email alerts on new titles in their areas of interest. A regularly updated blog provides information on the latest market trends.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Software Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Report Buyer Ltd

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+]

 
 
# # #
 
Software Warnings - IMPORTANT:
Always be aware/cautious about what you download on your computer/mobile! PURCHASE SOFTWARE related keywords / Banner Ads. Click HERE for details!
.

 
  Your Banner Ad showing on ALL
Software articles,
CATCH Visitors via Your Competitors Announcements!


New Report from ReportBuyer.com Highlights Increase in the Use of Wafer Level Packaging

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

|
Publisher Contact: Jonna Dagliden 
+44 (0) 20 7060 7474 press[.]reportbuyer.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Report Buyer Ltd securities in any jurisdiction including any other companies listed or named in this release.

Software via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Report Buyer Ltd / Company Profile


Read Software Most Recent Related Newswires:

Bomgar Launches Most Secure iOS Screen Sharing for Support Professionals
PROS Announces Plans to Showcase Revenue Management, Dynamic Pricing, eCommerce Solutions at IATA World Passenger Symposium
Noble SmartAccept® Receives 2017 Contact Center Technology Award
Infinera Auto-Lambda Radically Simplifies Distributed Access Architecture for Cable Networks
Ribeiro Selects Oracle Retail to Anticipate Demand and Gain More Omnichannel Agility
Splunk Acquires SignalSense
NAKIVO Announces Q3 2017 Results and Revenue Growth of 84%
IBM and Dream Payments Expand Payment Services on the Cloud to U.S. Financial Institutions
Oracle Financial Services Transaction Filtering Now Available
OneLogin Announces Real-Time Offboarding for Workday to Mitigate Risk of Company Data Theft
Altitude and Comways Announce AI-Powered Case Management for Omnichannel Customer Engagement
IBM Introduces Industry Platform Designed Specifically for Insurers
eClinicalWorks Announces Capability to Connect to Multiple Specialty Registries through Partnership with FIGmd
RISE Commercial Property Services Adopts the Yardi Commercial Suite
Saba Advances Talent Management Leadership with New Capabilities in Saba Cloud and TalentSpace Platforms

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  BizJobs.com

Visit  RightITnow Ltd





 
  ©2017 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)