At the 30th Control International (control-messe.de) trade fair for quality assurance, Bruker today announced the release of the innovative and unique Contour CMM™ dimensional analysis system, which is the world’s first non-contact metrology system to perform simultaneous nanoscale surface height, texture, waviness and form measurements, as well as 3D coordinate measurements for geometric dimensioning and tolerancing (GD&T), all on one instrument. Leveraging decades of world-leading optical metrology innovation, the system performs rapid, non-contact precision measurements to meet the industry’s most stringent standards. The Contour CMM system enables more accurate and convenient metrology for R&D and manufacturing of small structures in precision-machined components across a wide range of industries, from medical devices and optics, to automotive and aerospace.
“Contour CMM is an exciting breakthrough in the marriage of high-resolution optical surface profiling and coordinate measurement,” said Donald K. Cohen, Ph.D., Managing Member at Michigan Metrology, LLC. “It will allow engineers and researchers to examine parts in a completely new way and develop data that has previously been impossible to generate. Designers and manufacturers of precision components will gain significant value from having this capability to accelerate development and increase the quality of their products.”
“The Contour CMM system is a new enabler that fills a technology gap that industry has desired to bridge for many years,” added James Earle, Vice President and General Manager of Bruker’s Tribology, Stylus and Optical Metrology Business. “Our customers have had to face the uncertainties that come from fusing data from multiple technologies to solve manufacturing problems or investigate materials. Now they can get all the detailed surface metrology they have come to rely upon from our systems, and also locate that data within the larger form for true, one-stop characterization."
About the Contour CMM Dimensional Analysis System
Contour CMM transcends the boundaries of surface and coordinate characterization, quantifying a metrology continuum from surface roughness and texture through waviness into true 3D coordinate measurements of geometric dimensions with tolerancing analysis. The instrument exploits Bruker’s industry-leading Wyko® interferometric optical profiling technology in a proprietary optical probe. This generates extremely high vertical (2-nanometer) and lateral (0.9 micron) resolution surface finish data. High accuracy stages enable utilization of this surface data as building blocks for a true part coordinate system with form error less than 2 microns. Its Vision Dimensions™ software offers proprietary features specifically designed for small-part characterization, including automation for part programs, hundreds of preset analyses, and customized inspection reports. For advanced R&D, such as the measurement of material wear on medical implants or bearing races, the Contour CMM system provides, in a single instrument, the ability to quantify the smallest of wear scars with submicron accuracy, while enabling engineers to position where the scars are on the parts and report the deviation of the inspected part from CAD.
About Bruker Corporation
For more than 50 years, Bruker (bruker.com) has enabled scientists to make breakthrough discoveries and develop new applications that improve the quality of human life. Bruker’s high-performance, scientific research instruments and high-value analytical solutions enable scientists to explore life and materials at molecular, cellular and microscopic levels. In close cooperation with our customers, Bruker is enabling innovation, productivity and customer success in life science molecular research, in applied and pharma applications, in microscopy, nano-analysis and industrial applications, as well as in cell biology, preclinical imaging, clinical research, microbiology and molecular diagnostics.
Investor Contact: Joshua Young - Vice President, Investor Relations
T: +1 978-663-3660 x1479 - E: Joshua.young[.]bruker.com.