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Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs Using Thermocompression - World-leading nano-electronics research center imec and Besi, announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding - Besi.com / imec.be
Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs Using Thermocompression

 

NewswireToday - /newswire/ - Leuven, Belgium, 2015/07/14 - World-leading nano-electronics research center imec and Besi, announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding - Besi.com / imec.be.

   
 
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At SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology.

3D IC technology, stacking multiple dies into a single device, aims to increase the functionality and performance of next-generation integrated circuits while reducing footprint and power consumption. It is a key technology to enable the next generation of portable electronics, such as smartphones and tablets, which require smaller ICs that consume less power.

One of the challenges to making 3D IC manufacturing an industrial reality is the development of a high-throughput automated process flow for narrow-pitch, high-accuracy die-to-die and die-to-wafer bonding. Thermocompression bonding (TCB) is a widespread process used by the industry for highly accurate die-to-package bonding. The method released the stress in the laminate layer and avoided stress to build up between the two stacked layers. Yet, more traditional approaches to thermocompression bonding come with long cycle times (>1 minute per die), meaning significant improvements in throughput are required to enable this stacking approach on a 300mm wafer.

Imec and Besi have developed an automated TCB process on 300 mm wafers for Besi’s new 8800 TC bonder tool. Imec and Besi demonstrated die-to-wafer bonding at high accuracy, sufficient for 50 µm pitch solder micro bump arrays and a throughput of >1000 UPH with a dual bond head configuration

“Collaborating with imec, leveraging their expertise on fine pitch bonding materials and processes, has enabled us to develop our 8800 TC bonder tool according to the needs of the semiconductor industry,” said Hugo Pristauz at Besi. “This collaboration has helped us to offer our customers a viable and effective solution for 2.5D/3D IC manufacturing, especially for the new C2W applications.”

About imec
Imec (imec.be) performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in the Netherlands, Taiwan, USA, China, India and Japan. Its staff of about 2,200 people includes almost 700 industrial residents and guest researchers. In 2014, imec's revenue (P&L) totaled 363 million euro.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.)and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited).

About Besi
Besi (besi.com) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on NYSE Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands.

Besi Contact: Hugo Pristauz, VP Product Line TCB & Die Sorting
M: +43 664 2550 816 - E: hugo.pristauz[.]gmail.com.

 
 
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Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs Using Thermocompression

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Besi’s New 8800 TC Bonder | Imec
Publisher Contact: Hanne Degans - imec.be 
+32 16 28 17 69 / +32 486 06 51 75 (mobile) hanne.degans[.]imec.be
 
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