The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies. The IGBT5 allows for higher power density with reduced static and dynamic losses, whereas the .XT interconnection technology extends lifetime by increased thermal and power cycling capabilities. As a result, the new PrimePACK modules are the best choice for the majority of high power inverters in applications like wind, solar and industrial drives.
The new PrimePACK modules include the latest IGBT5 chip from Infineon with a 25 K higher maximum operation junction temperature, allowing for a maximum junction temperature of T vjop=175 °C. Compared to the previous generation the new IGBT5 chips show an improved soft switching behavior along with reduced total losses. This enables a higher power density in 1200 V and 1700 V applications. As a consequence, within the same PrimePACK footprint the output current of the application can be increased by 25 percent.
The well-established PrimePACK has been enhanced with Infineon’s .XT interconnection technology to fulfill today’s and tomorrow’s lifetime requirements. This has been realized by sintering of IGBT chips and diodes along with improved system soldering and copper bonds instead of aluminum bonds. Applications can now benefit from increased system availability due to an extended lifetime of PrimePACK modules by the factor ten.
By integrating IGBT5 and .XT technology into PrimePACK, Infineon provides a new degree of freedom to system designers. Using the new PrimePACK with IGBT5, the output power of the application can either be increased by 25 percent, or a tenfold increase of lifetime for the same output current can be realized. For the same output power the cooling efforts can be significantly reduced, while on the other hand higher system overload conditions are enabled. Various tradeoffs between output power and lifetime are feasible. With this new design flexibility the best set-up for the majority of system applications can be realized.
The new PrimePACK™ 3+ housing for the high current modules provides an additional AC terminal and bus bar, which leads to increased current carrying capabilities, while a low-inductance connectivity to the collector of the bottom IGBT is realized by an additional control terminal.
Infineon will introduce the new PrimePACK generation at PCIM 2015 with 1200 V / 1200 A (FF1200R12IE5) and 1700 V / 1800 A (FF1800R17IP5) lead types. The portfolio will be expanded with modules providing 1200 V / 1500 A, 1200 V / 1800 A, 1700 V / 1200 A and 1700 V / 1500 A.
Infineon at the PCIM 2015
Infineon will be presenting the PrimePACK with IGBT5 and .XT, as well as other innovative system oriented solutions, at booth 412 in hall 9 at the PCIM trade show in Nuremberg from May 19 to 21, 2015. Further information on trade show highlights is available at infineon.com/PCIM.
Infineon Technologies AG (infineon.com) is a world leader in semiconductors. Infineon offers products and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2014 fiscal year (ending September 30), the company reported sales of Euro 4.3 billion with about 29,800 employees worldwide. In January 2015, Infineon acquired US-based International Rectifier Corporation, a leading provider of power management technology, with revenues of USD 1.1 billion (2014 fiscal year ending June 29) and approximately 4,200 employees.
Information Number: INFIPC201505-054