PRTODAY / NewswireToday Free press release distribution service network

Written by / Agency / Source: Infineon Technologies AG

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

PrimePACK™ Combines Latest IGBT5 with .XT Interconnection Technology for Higher Lifetime and Power Density - At this year's PCIM 2015 trade show Infineon Technologies AG will present the latest generation of its PrimePACK™ power modules which benefit from the new generation of Infineon’s IGBTs - Infineon.com
PrimePACK™ Combines Latest IGBT5 with .XT Interconnection Technology for Higher Lifetime and Power Density

 

NewswireToday - /newswire/ - Munich, Germany, 2015/05/12 - At this year's PCIM 2015 trade show Infineon Technologies AG will present the latest generation of its PrimePACK™ power modules which benefit from the new generation of Infineon’s IGBTs - Infineon.com. FSE: IFX; OTCQX: IFNNY

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies. The IGBT5 allows for higher power density with reduced static and dynamic losses, whereas the .XT interconnection technology extends lifetime by increased thermal and power cycling capabilities. As a result, the new PrimePACK modules are the best choice for the majority of high power inverters in applications like wind, solar and industrial drives.

The new PrimePACK modules include the latest IGBT5 chip from Infineon with a 25 K higher maximum operation junction temperature, allowing for a maximum junction temperature of T vjop=175 °C. Compared to the previous generation the new IGBT5 chips show an improved soft switching behavior along with reduced total losses. This enables a higher power density in 1200 V and 1700 V applications. As a consequence, within the same PrimePACK footprint the output current of the application can be increased by 25 percent.

The well-established PrimePACK has been enhanced with Infineon’s .XT interconnection technology to fulfill today’s and tomorrow’s lifetime requirements. This has been realized by sintering of IGBT chips and diodes along with improved system soldering and copper bonds instead of aluminum bonds. Applications can now benefit from increased system availability due to an extended lifetime of PrimePACK modules by the factor ten.

By integrating IGBT5 and .XT technology into PrimePACK, Infineon provides a new degree of freedom to system designers. Using the new PrimePACK with IGBT5, the output power of the application can either be increased by 25 percent, or a tenfold increase of lifetime for the same output current can be realized. For the same output power the cooling efforts can be significantly reduced, while on the other hand higher system overload conditions are enabled. Various tradeoffs between output power and lifetime are feasible. With this new design flexibility the best set-up for the majority of system applications can be realized.

The new PrimePACK™ 3+ housing for the high current modules provides an additional AC terminal and bus bar, which leads to increased current carrying capabilities, while a low-inductance connectivity to the collector of the bottom IGBT is realized by an additional control terminal.

Availability
Infineon will introduce the new PrimePACK generation at PCIM 2015 with 1200 V / 1200 A (FF1200R12IE5) and 1700 V / 1800 A (FF1800R17IP5) lead types. The portfolio will be expanded with modules providing 1200 V / 1500 A, 1200 V / 1800 A, 1700 V / 1200 A and 1700 V / 1500 A.

Infineon at the PCIM 2015
Infineon will be presenting the PrimePACK with IGBT5 and .XT, as well as other innovative system oriented solutions, at booth 412 in hall 9 at the PCIM trade show in Nuremberg from May 19 to 21, 2015. Further information on trade show highlights is available at infineon.com/PCIM.

About Infineon
Infineon Technologies AG (infineon.com) is a world leader in semiconductors. Infineon offers products and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2014 fiscal year (ending September 30), the company reported sales of Euro 4.3 billion with about 29,800 employees worldwide. In January 2015, Infineon acquired US-based International Rectifier Corporation, a leading provider of power management technology, with revenues of USD 1.1 billion (2014 fiscal year ending June 29) and approximately 4,200 employees.

Information Number: INFIPC201505-054

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Infineon Technologies AG

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+] / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Electronics/Instrumentation/RFID articles,
CATCH Visitors via Your Competitors Announcements!


PrimePACK™ Combines Latest IGBT5 with .XT Interconnection Technology for Higher Lifetime and Power Density

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

PrimePACK™ | Infineon Technologies AG
Publisher Contact: Fabian Schiffer - Infineon.com 
+49 89 23425869 fabian.schiffer[.]infineon.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Infineon Technologies AG securities in any jurisdiction including any other companies listed or named in this release.

Electronics/Instrumentation/RFID via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Infineon Technologies AG / Company Profile


Read Electronics/Instrumentation/RFID Most Recent Related Newswires:

Frost & Sullivan Commends Keysight's Growth in Calibration and Repair Services from its New Customer-centric Solutions
Imec Develops 3D-Compatible Germanium nMOS Gate stack with High Mobility and Superior Reliability
Curtiss-Wright to Expand Position in Data Acquisition & FTI Markets with Acquisition of Teletronics Technology Corporation
Datalogic Receives Top Honor At Inspect Awards 2017
Leonardo Sees Surge in Export Orders for Man-portable Laser Designators from US and Europe
Imec Demonstrates World’s First Vertically Stacked Gate-all-Around Si Nanowire CMOS Transistors
GE Ventures, Microsemi and Corning Partner to Launch Menlo Micro and Next Generation of Electronic Switching
Frost & Sullivan Commends LeEco for Driving Innovation in the North American Smart Technologies Market
Malvern Instruments and PANalytical to Merge
Bruker Announces Corporate Partnership with International Phenome Centre Network (IPCN) for NMR Technologies and SOPs
Predictive and Control Capabilities through IoT Rapidly Expand Global Growth Opportunities for Sensors Finds Frost & Sullivan
IDEX Showcased the World’s First Flexible Touch Fingerprint Sensor for SmartCards and Receives Massive Industry Interest
Endress+Hauser Consult AG Introduces Proline 300/500 - Flow Measuring Technology for the Future
Lipigas Delivers Enhanced Interactive and Visual Mobile Self-Service Portal Using Joint Visual IVR Solution from Dialogic and Telectronic
Customized Electronic Ticket Solutions Simplify Daily Commute in Russian Cities

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  Triggr & Bloom

Visit  JobsWare.com





 
  ©2016 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)