PRTODAY / NewswireToday Free press release distribution service network

More news: Engineering
Written by / Agency / Source: Mentor Graphics Corporation

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization - Mentor Graphics Corporation announced its Xpedition™ Path Finder product suite, providing designers with the ability to assemble and optimize complex electronic systems, and thereby enabling improved design, increased chip performance, and cost efficiency
Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization

 

NewswireToday - /newswire/ - Wilsonville, OR, United States, 2014/06/09 - Mentor Graphics Corporation announced its Xpedition™ Path Finder product suite, providing designers with the ability to assemble and optimize complex electronic systems, and thereby enabling improved design, increased chip performance, and cost efficiency. NASDAQ: MENT

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Engineering Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

This product, the newest addition to the Mentor Graphics® Xpedition platform, supports a methodology that leverages layout data from the IC and board design teams to guide and automate IC package selection and optimization.

The Xpedition Path Finder suite provides a single environment that gives cross-domain design teams the ability to model every device/interface to the level of detail and accuracy they require. IC layout design data can be represented as a virtual die model (VDM), containing all of the IC-level detail specific to the co-design and optimization process. Board design data can be modelled as individual interfaces or as complete designs. Packages can be built based on industry-leading pin array generation and manipulation capabilities, existing devices, and industry-standard formats. Cross-domain design teams can now make smart planning and optimization decisions related to cost and performance of their IC package in context of the complete system.

“Mentor’s Xpedition Path Finder technology provides unique capabilities not found elsewhere, which is important for our business as a design services partner for major semiconductor companies,” said Farhang Yazdani, president and chief technical officer of BroadPak. “We’re realizing substantial time and cost savings using Path Finder, while improving the overall quality and performance of the package designs.”

Developed to Address Today’s Systems Design Complexity
The Xpedition Path Finder suite addresses the increasing design complexity of system on chip (SoCs) and multi-die packaging growth by providing the industry’s first new path-finding methodology that automates the planning, optimization, and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms.

Using the multi-mode connectivity environment, designers can capture and manage connectivity based on their preference; table-based, graphical schematics or automated. Cross-domain pin mapping and net combining can easily be managed in all modes of connectivity capture. In addition, users can perform rules-based pin/ball-out studies from their respective domains, by signal, bus or interface, visualizing the impact across the complete system in real time. Path Finder also streamlines and automates the library development process, reducing a several day task down to a few minutes.

“The exponential increase in electrical systems design complexity is motivating Mentor to deliver solutions to the marketplace that address new design and manufacturing challenges,” stated Henry Potts, general manager and senior vice president of Mentor Graphics Systems Design Division. “We are very excited by the customer feedback we have received on our Path Finder technology and we are looking forward to wider deployment, enabling designers to achieve optimum productivity.”

Xpedition Path Finder The Comprehensive Solution for Package Path Finding
The Xpedition Path Finder suite is comprised of a multi-mode connectivity engine and optimization engine/editor, leveraging a physical layout tool with industry-leading routing technology. Unique and specialized features in the Path Finder suite include:

• A correct-by-construction layout environment that enables designers to optimize performance and manufacturability on the densest designs populated by high-pin-count flip-chip BGAs. The core Xpedition layout tool provides: unique BGA breakout and escape algorithms coupled with support for complex microvia structures; shape-based, any-angle routing; plane areas that dynamically fill around traces and vias during editing; patented technology enabling efficient, concurrent design by large teams; and integrated RF circuit design and optimization
• Rule-based ball-out assignment, including an optimization engine/editor for planning by bank, byte, reference voltage, clock domain, etc. an intelligent way to show a ball map: simply create, import, and export
• Single tool for multi-mode physical design (PCB, MCM, SiP, RF, Hybrid and BGA designs) that reduces design time orders of magnitude compared to other available products using Microsoft-based Component Object Model (COM) automation for robust extension and customization capabilities
• Streamlined and fully automated library development
• Virtual Die Model (VDM) to accurately capture IC layout (floor planning) design intent, facilitating WYSIWYG IC and package co-optimization.
• Tight integration with 2D and 3D electro-magnetic (EM) and computational fluid dynamics (CFD) thermal analysis engines.

Xpedition Path Finder Product Availability
The Xpedition Path Finder suite is available today and is an EDA vendor-neutral flow. The product leverages other Mentor Graphics tools such as the HyperLynx® signal and power integrity product, and 3D full-wave EM analysis tools, Xpedition layout technology, the FloTHERM® CFD thermal modelling tool, visECAD®/CAMCAD design comparison tool, and Valor® NPI substrate fabrication checking tool. For product pricing, consult your Mentor Graphics sales representative or call 1-800-547-3000.

(Mentor Graphics, HyperLynx, FloTHERM, visECAD and Valor are registered trademarks and Xpedition is a trademark of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)
About Mentor Graphics

Mentor Graphics Corporation (mentor.com) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the worlds most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year in excess of $1.15 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Engineering Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Mentor Graphics Corporation

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+] / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Engineering articles,
CATCH Visitors via Your Competitors Announcements!


Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

|
Publisher Contact: Larry Toda - Mentor.com 
503-685-1664 larry_toda[.]mentor.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Mentor Graphics Corporation securities in any jurisdiction including any other companies listed or named in this release.

Engineering via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Mentor Graphics Corporation / Company Profile


Read Engineering Most Recent Related Newswires:

ABB Takes Smart Home Experience to New Heights with Amazon and Sonos Solutions
Databricks Secures $140 Million to Accelerate Analytics and Artificial Intelligence in the Enterprise
Lahmeyer Hands Over First EPC Contract to PLN for 135 MW CCPP Lombok, Indonesia
Lahmeyer Signs Memorandum of Cooperation with COIDIC
ABB Wins $30 Million Order to Upgrade Nordic HVDC Link
ABB Completes Acquisition of B&R
TruTag Wins 2017 North American Frost & Sullivan Award for Technology Innovation
ABB Acquires KEYMILE’s Communication Networks Business to Strengthen Digital Grid Portfolio and Software Focus
ABB Delivers DolWin2 Wind Connection
ABB Strengthens Commitment to Canada
Singapore to Convene Luminary Global Energy Leaders to Support Low Carbon Future
ABB to Propose KPMG as External Auditor from 2018
ABB Reduces Operational Costs of Italian Water Company with Energy Management Solution by 30 Percent
ABB and Vattenfall Recognized for Pioneering HVDC Technology
ABB Wins $30 Million Order for HVDC Power Link Upgrade in Africa

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  JobsWare.com

Visit  RightITnow Ltd





 
  ©2017 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)