The international technology Group SCHOTT enables the development of very fast, next-generation Ethernet transceivers by offering hermetic packages with miniaturized high-temperature co-fired ceramics (HTCC) feedthroughs for 100 Gbit/s Quad Small Form-factor Pluggable (QSFP) transceivers, one of the fastest data communication transceivers on the market. The company also developed design varieties of its high-performance 28 Gbit/s TO PLUS® packages to suit a larger variety of differential and single-ended high-frequency applications. SCHOTT is showcasing its HTCC feedthroughs and its TO PLUS® packages at the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC) on March 11 to 13, 2014 in San Francisco (booth #2021).
Recently introduced to the market, the HTCC feedthrough for 4x25 Gbit/sec transceivers in the QSFP footprint is the smallest and the most powerful package available for short-distance communications, allowing for unprecedented data transfer speeds of 28 Gbit/s. It is used in transceivers in fiber optic networks for data communications and enterprise data centers. The product is currently available to customers for qualification.
“Our depth of knowledge in HTCC feedthroughs strengthened the design of this miniature package, which offers a high-density interconnect solution for the radio frequency (RF) interfaces,” explains Joe Hale, North American Director of Sales and Marketing at SCHOTT Electronic Packaging.
TO PLUS®: Larger variety of designs and customized solutions
SCHOTT now offers its 28 Gbit/s TO PLUS® packages in different designs, making them suitable for an expanded variety of differential and single-ended high-frequency applications. Sampling kits for standard layouts are available for interested parties. “We received a lot of positive feedback from customers who ordered our product for testing. Our own measurement data confirms our customers’ positive results,” explains Robert Hettler, Head of Research & Development Opto-Electronics at SCHOTT Electronic Packaging. The performance of SCHOTT’s header is in line with the requirements of Fibre Channel components.
In addition to its standard portfolio, SCHOTT offers customized TO PLUS® solutions. “For us, the TO PLUS® header is not just a product, it underscores our research and development capability in this domain of high frequency applications,” states Hale. “We can also offer designs of flexible printed circuits (FPC) so that the TO package can be reliably connected to the transceiver board and retain its high-speed transmission properties.”
The 28 Gbit/s TO PLUS® header underscores SCHOTT’s leadership in designing and manufacturing TO packages. It is the only package on the market that enables a data transfer speed of 28 Gbit/s.
SCHOTT has established the ideal method for miniaturizing and reproducibly manufacturing HTCC-RF feedthroughs by using extremely fine conductor paths (down to 80 µm) and employing the smallest via diameters (100 µm). The feedthroughs are key components in more sophisticated hybrid housings that can accommodate interfaces for RF and optical signals as well as DC, thermal, and mechanical interfaces. SCHOTT also offers SMD-enabled feedthroughs and housings designed to transmit data rates of 4x25 Gbit/sec to handle long-distance and short-distance data communications. With capabilities like these and a global production footprint, SCHOTT is well positioned to serve as a leading global supplier of hermetic housing solutions for high-frequency applications.
The TO PLUS® header combines the advantages of the industry-standard, hermetically sealed TO-CAN package with high-frequency transmission capabilities to create components that provide high throughput rates for large volumes of data in existing structures. Data transmission rates continue to increase, especially in the field of data and telecommunications. The Fibre Channel transmission standard in storage area networks (SANs) requires extremely fast data lines in data processing centers, and thus extremely high data transfer speeds. The new TO PLUS® component meets these demands, and was especially designed for use with vertical cavity surface emitting lasers (VCSEL) as transmitter optical sub-assemblies (TOSA) and receiver optical sub-assemblies (ROSA).
For more information, visit us.schott.com/epackaging.
TO PLUS® is a registered trademark of SCHOTT AG.
SCHOTT (schott.com) is an international technology group with more than 130 years of experience in the areas of specialty glasses and materials and advanced technologies. SCHOTT ranks number one in the world with many of its products. Its core markets are the household appliance, pharmaceutical, electronics, optics and transportation industries. The company is strongly committed to contributing to its customers’ success and making SCHOTT an important part of people’s lives with high-quality products and intelligent solutions. SCHOTT is committed to managing its business in a sustainable manner and supporting its employees, society and the environment. The SCHOTT Group maintains close proximity to its customers with manufacturing and sales units in 35 countries. Its workforce of 15,400 employees generated worldwide sales of 1.84 billion euros for the 2012/2013 fiscal year.
Press contact: Mike Lizun - Gregory FCA on behalf of SCHOTT
P: 610-642-1435 - E: mike[.]gregoryfca.com.