PRTODAY / NewswireToday Free press release distribution service network

Written by / Agency / Source: Imec

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Besi and Imec Collaborate on Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs - At the SEMI European 3D TSV Summit, imec and Besi, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput - Besi.com / imec.be
Besi and Imec Collaborate on Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

 

NewswireToday - /newswire/ - Grenoble, France, 2014/01/20 - At the SEMI European 3D TSV Summit, imec and Besi, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput - Besi.com / imec.be.

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

At the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing.

3D IC technology, stacking multiple dies into a single device, aims to increase the functionality and performance of next-generation integrated circuits while reducing footprint and power consumption. It is a key technology to enable the next generation of portable electronics, such as smartphones and tablets, which require smaller ICs that consume less power.

One of the key challenges to making 3D IC manufacturing a reality is the development of high-throughput automated process flow for narrow-pitch, high-accuracy die-to-die and die-to-wafer bonding. Flip chip and reflow soldering, which are currently combined for bonding, require lenient bonding accuracy on large bump pitches (around 150-50 µm bump pitch). Bump pitches need to further scale down to 40-10 µm to realize a sufficiently high performance. This needs high accuracy in bonding within the range of 1-2um [.]3sigma. Moreover, an automatic process flow is essential for industrial adoption. Thermocompression bonding is a method that enables this high bonding accuracy on narrow bump pitches, although with this comes long cycle times due to temperature and pressure profiles and processing methods which hinder industrial adoption of this technology up to now.

Imec and Besi will conduct joint research to develop a high-throughput thermocompression bonder in an automated process flow, with high accuracy and shorter cycle times, paving the way to enabling a manufacturable 3D, 2.5D and 2.5D/3D hybrid technology.

“We are excited to work with a key research center such as imec and leverage its expertise in fine pitch bonding materials and processes to increase the yield and reliability of our equipment,” said Richard Blickman, CEO at Besi. “This collaboration will enable us to benchmark our Chameo tool to meet the industrial needs of the semiconductor industry, offering our customers a viable and effective solution for 2.5D/3D IC manufacturing.”

About imec
Imec (imec.be) performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of over 2,080 people includes more than 670 industrial residents and guest researchers. In 2012, imec's revenue (P&L) totaled 320 million euro.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited).

About Besi
Besi (besi.com) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on NYSE Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands.

Contact: Besi: Richard Blickman, CEO
T: +31 26 319 4500 - E: investor.relations[.]besi.com.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Electronics/Instrumentation/RFID Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Imec

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+] / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Electronics/Instrumentation/RFID articles,
CATCH Visitors via Your Competitors Announcements!


Besi and Imec Collaborate on Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

Imec | Besi
Publisher Contact: Hanne Degans - imec.be 
+32 16 28 17 69 / +32 486 06 51 75 (mobile) hanne.degans[.]imec.be
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Imec securities in any jurisdiction including any other companies listed or named in this release.

Electronics/Instrumentation/RFID via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Imec / Company Profile


Read Electronics/Instrumentation/RFID Most Recent Related Newswires:

Malvern Instruments and PANalytical to Merge
Bruker Announces Corporate Partnership with International Phenome Centre Network (IPCN) for NMR Technologies and SOPs
Predictive and Control Capabilities through IoT Rapidly Expand Global Growth Opportunities for Sensors Finds Frost & Sullivan
IDEX Showcased the World’s First Flexible Touch Fingerprint Sensor for SmartCards and Receives Massive Industry Interest
Endress+Hauser Consult AG Introduces Proline 300/500 - Flow Measuring Technology for the Future
Lipigas Delivers Enhanced Interactive and Visual Mobile Self-Service Portal Using Joint Visual IVR Solution from Dialogic and Telectronic
Customized Electronic Ticket Solutions Simplify Daily Commute in Russian Cities
Bruker AXS Introduces A New Member to The D8 ADVANCE Family - The D8 ADVANCE Plus™
Spellman to Exhibit at the 2016 Radiological Society of North America Meeting in Chicago
Infineon Teams Up with Chinese Appliance Manufacturers for Solutions
Infineon Raises its Through-cycle Target for The Segment Result Margin to 17 Percent
Smartphones and Wearables Market Poised for Growth with Next-Generation Sensors Key Enabler of Innovation
Infineon Complements IMOTION™ Modular Application Design Kit with Two Power Boards
Malvern and PANalytical Announce Merger
Bruker Completes Acquisition of Preclinical PET Imaging Business

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  La Bella Bakery Artisan Bakery Arizona

Visit  K A C, Images and U, LLC





 
  ©2016 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)