Qualcomm Incorporated today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has expanded its automotive product offerings by introducing an automotive-grade infotainment chipset, the Qualcomm® Snapdragon™ 602A applications processor with a quad-core Krait™ CPU, Adreno™ 320 GPU, Hexagon™ DSP, integrated GNSS baseband processing and additional high-performance audio, video and communication cores. The Snapdragon 602A processor is designed to meet stringent automotive industry standards for temperature, quality, longevity and reliability and is AEC-Q100 compliant. The Snapdragon 602A processor is pre-integrated with Qualcomm Gobi™ 9x15 multimode 3G/4G-LTE and QCA6574 Qualcomm VIVE™ 2-stream, dual-band 802.11ac Wi-Fi and Bluetooth LE 4.0-based modules to provide unprecedented, integrated connectivity options for connected infotainment systems. Building on more than a decade of success with Qualcomm Gobi modems that enable connected car services in more than 10 million vehicles globally, Snapdragon Automotive Solutions brings the leading edge capabilities that power many of today’s top smartphone and tablet experiences to the car.
With all the built-in capabilities and superior low power/high performance of the Snapdragon 602A processor, sophisticated next-generation connected automotive infotainment systems are made possible. Multiple OS support, complex user applications, enhanced 3D navigation, high-resolution, sophisticated graphics and HMIs, facial recognition, gesture recognition, and rear seat 3D gaming are possible with the Krait CPU and Adreno GPU. Natural voice recognition, high-quality audio processing, codecs, image stitching, and third party provided DSP algorithms are enabled by the on-chip Hexagon DSP. Additionally, multiple HD displays and cameras with hardware accelerated, simultaneous decode and encode are supported by the Snapdragon 602A processor’s internal video and camera processing engines.
The Gobi 9x15, Qualcomm Technologies’ second generation multimode 3G/4G LTE chipset, enables Internet connectivity for enhanced 3D navigation, cloud-based services and applications, multimedia streaming and downloads, as well as general web browsing. The chipset’s multi-band support enables seamless connectivity between LTE TDD/FDD, CDMA 1x and 1xEV-DO, DC-HSPA+ and UMTS, TD-SCDMA and GSM/EDGE networks, as well as provides automakers with a proven, global platform to build and host their software and services. In addition, Qualcomm VIVE 2-stream, dual-band 802.11ac Wi-Fi and Bluetooth LE 4.0 solutions for in-car connectivity enables wireless hotspot functionality with support for up to eight simultaneous device connections, content streaming from the head unit to multiple devices with Miracast™, MirrorLink™ 1.2 and AllJoyn™. Also enabled is hands free telephony and vehicle-to-home content streaming through the Qualcomm 2x2 VIVE 2-stream 802.11ac Wi-Fi and Bluetooth LE 4.0 module with multiple antennas and advanced LTE/Wi-Fi/Bluetooth coexistence techniques that maintain reliable wireless connections in the harsh automotive environment.
Snapdragon Automotive Solutions pre-integrate support for the Android and QNX CAR™ platforms with automotive-specific optimizations and integrated application frameworks, accelerating automaker’s abilities to build systems compliant with automotive requirements for fast boot of critical services. In addition, Snapdragon Automotive Solutions offers power and performance optimized graphics, audio and video frameworks, as well as dual mode support for 802.11, Miracast, and automotive Bluetooth profiles such as A2DP, AVRCP, HFP, PBAP and MAP. The platform is designed to interoperate with consumer devices from leading smartphone and tablet ecosystems to deliver the right blend of in-car integrated infotainment with brought-in experiences. Use of this production quality, optimized software supporting BSPs, OSs, stacks and frameworks enables infotainment system integrators to significantly reduce software development time and risk and begin final production software qualification earlier.
“We are excited to bring to the car the same mobile technologies and Snapdragon experiences consumers around the world enjoy on their mobile devices,” said Kanwalinder Singh, Senior Vice President of Business Development for Qualcomm Technologies, Inc. “Building on top of Gobi 3G connectivity already embedded in vehicles globally and Gobi 4G LTE connected cars being rolled out in 2014, the Snapdragon 602A will enable the next generation of connected infotainment in the car.”
As part of Snapdragon Automotive Solutions, Qualcomm Technologies also has announced the Snapdragon Automotive Development Platform, which is anticipated to commence sampling in Q1 of 2014. This new platform demonstrates the highly integrated, BOM optimized hardware available only through Qualcomm Technologies’ integrated automotive infotainment solution and comes with support for Android and QNX software packages, allowing customers to evaluate, demonstrate and develop on a highly integrated Qualcomm Snapdragon platform focused on the automotive industry.
About Qualcomm Incorporated
Qualcomm Incorporated (qualcomm.com) is the world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other.
Qualcomm, Snapdragon, Gobi, Krait, Adreno and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Miracast and VIVE are trademarks of Qualcomm Incorporated. AllJoyn is a trademark of Qualcomm Innovation Center, Inc. Qualcomm Snapdragon, Gobi, Krait, Adreno and Hexagon are products of Qualcomm Technologies, Inc. Miracast and VIVE are products of Qualcomm Atheros, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Bluetooth is a registered trademark of the Bluetooth Special Interest Group. Android is a trademark of Google Inc. All Qualcomm Incorporated trademarks are used with permission. Other products or brand names may be trademarks or registered trademarks of their respective owners.
Warren Kneeshaw, Investor Relations
P: +1 858-658-4813 - E: ir[.]qualcomm.com.