NewswireToday - /newswire/ -
Manassas, VA, United States, 2013/12/06 - ZESTRON will hold a presentation at 2013 IPC Apex conference in Shenzhen Convention & Exhibition Center on December 6th - InfoZestronChina.com / ZESTRON.com.
In this technical conference Mr. Jimmy Tian, Experienced process engineer, ZESTRON China, will present the findings of the study: “Is Cleaning Critical to PoP Assemblies?” from 14:10-14:50.
Package on package (PoP) assemblies are widely growing in use for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA. As a result, PoP’s have become an ideal component selection for products such as advanced mobile platforms and digital cameras.
This technical paper, presented by Mr. Jimmy Tian, will emphasize how effective cleaning improves product reliability by ensuring optimal surface resistance between the solder bumps and by preventing current leakage that can lead to PCB failure. Furthermore, this technical paper will address the cleanliness level of required PoP assemblies including underneath PoP components and in between packages. Expected results will empirically confirm the effectiveness of cleaning technologies for this rapidly evolving technology.
For more information on this topic, please join Mr. Jimmy Tian at IPC Apex, or contact ZESTRON’s Application Technology Department at info[.]zestronchina.com/.
ZESTRON (zestron.com) offers the world’s leading cleaning media, but more importantly focuses on being an architect for reliable cleaning processes within electronic and metal parts cleaning applictions. It is ZESTRON’s goal to always provide a cleaning process in which the quality of the cleaning result is the same after 300,000 cycles as it was at the initial start-up, irrespective of quantity and performance requirements.