PRTODAY / NewswireToday Free press release distribution service network

More news: Engineering
Written by / Agency / Source: Mentor Graphics Corporation

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Mentor Graphics Tools Included in TSMC’s 3D-IC Reference Flow for True 3D Stacking Integration - Expands support for interposer- and TSV-based physical design, verification, extraction, thermal and testing to full 3D [NASDAQ: MENT] - Mentor.com
Mentor Graphics Tools Included in TSMC’s 3D-IC Reference Flow for True 3D Stacking Integration

 

NewswireToday - /newswire/ - Wilsonville, OR, United States, 2013/09/19 - Expands support for interposer- and TSV-based physical design, verification, extraction, thermal and testing to full 3D [NASDAQ: MENT] - Mentor.com. NASDAQ: MENT

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Engineering Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Mentor Graphics Corp. today announced that its solutions have been validated by TSMC with a true 3D stacking test vehicle for TSMC’s 3D-IC Reference Flow. The flow expands support from silicon interposer offerings to include TSV-based, stacked die designs. Specific Mentor® offerings include capabilities for metal routing and bump implementation, multi-chip physical verification and connectivity checking, chip interface and TSV parasitics extraction, thermal simulation, and comprehensive pre- and post-package testing.

The Mentor Graphics® 3D-IC flow for TSMC provides a rich set of enhancements across the Mentor IC product portfolio. The Olympus-SoC™ place and route system serves as the 3D-IC physical design cockpit for both silicon interposer- and TSV-based designs with support for cross-die bump mapping and checking; TSV, microbump, and backside metal routing; and copper pillar bump implementations.

The Pyxis® IC Station custom layout product provides schematic-driven layout that supports a TSV design flow. It also enables both orthogonal and 45 degree redistribution layer (RDL) routing. Specific enhancements for the TSMC 3D-IC flow include improvements to the bump file import process.

Whether the designer is working in a custom or digital design cockpit, the Calibre® nmDRC™ and Calibre nmLVS™ products provide inter-die design rule and layout vs. schematic checking, including IO alignment accuracy verification, and connectivity checking for double-sided bumps using either DEF or GDS input. The Calibre xRC™ and Calibre xACT™ products extract parasitics for backside routing and single- or double-sided bumps defined in DEF or GDS formats. They also handle TSV-to-TSV coupling extraction to drive static timing analysis and SPICE simulations, and generate TSV sub-circuit equivalents for multi-die parasitic models.

In the test area, the Mentor Tessent® MemoryBIST product supports testing of stacked Wide IO DRAM die, while Tessent TestKompress® provides die-to-stack level test pattern translations for both compressed and uncompressed test patterns. Tessent IJTAG also supports 3D interconnect tests for dies wrapped with IEEE 1149.1 and 1500 style wrappers.

To address the thermal issues inherent in 3D-IC designs, the Mentor FloTHERM® product provides both static and transient thermal models for dies and 3D assemblies, and works with the Calibre RVE™ and Calibre DESIGNrev™ products to provide die and package level temperature visualizations.

“Deep collaboration with Mentor in 3D-IC has resulted in a comprehensive solution for our mutual customers,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Extending Mentor products to cover true 3D stacking gives our customers flexibility to choose among different scaling alternatives, and a smooth transition between approaches.”

“It paves the way for our customers to access 3D-IC technology with comprehensive support of a full 3D-IC flow from physical design through thermal analysis, verification, extraction, and test without major disruption to their existing development process,” said Joseph Sawicki, vice president and general manager of the Design-to-Silicon division at Mentor Graphics. “The designer’s approach to scaling can remain focused on performance and cost targets, without the risk of unfamiliar methods and tools.”

(Mentor Graphics, Mentor, Calibre, Pyxis, FloTHERM, Tessent and TestKompress are registered trademarks and Olympus-SoC, nmDRC, nmLVS,, xRC, RVE, DESIGNrev and xACT are trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)

About Mentor Graphics
Mentor Graphics Corporation (mentor.com) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of nearly $1,090 million. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Engineering Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!


 

Written by / Agency / Source: Mentor Graphics Corporation

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+] / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Engineering articles,
CATCH Visitors via Your Competitors Announcements!


Mentor Graphics Tools Included in TSMC’s 3D-IC Reference Flow for True 3D Stacking Integration

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

|
Publisher Contact: Sonia Harrison / Gene Forte - Mentor.com 
503-685-1165 / 503-685-1193 sonia_harrison[.]mentor.com / gene_forte[.]mentor.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any Mentor Graphics Corporation securities in any jurisdiction including any other companies listed or named in this release.

Engineering via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From Mentor Graphics Corporation / Company Profile


Read Engineering Most Recent Related Newswires:

Rockwell Automation to Showcase Plantwide Control Solutions and Technology at POWER-GEN International
Premier Autonomous Vehicle Conference of The Southeast - 2016 Florida Automated Vehicle Summit
AEgis Technologies, Inc. to Demonstrate Affordable Training Alternatives At I/ITSEC 2016
Mentor Graphics Announces New FloEFD Product with Unique Capabilities
Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development
ABB Wins Order to Supply 1600 Transformers to Support Railway Expansion in India
Mentor Graphics Announces FloEFD Frontloading Computational Fluid Dynamics (CFD) Award Winners for 2016
Infineon Chip Solves Rubik's Cube in 637 Milliseconds
Seica to Distribute Mentor Graphics Process Preparation Tool for Flying Probe Test Systems
Mentor Graphics New FloMASTER Delivers Higher Accuracy, Extended Physics and Ease of Use
ABB Wins $40 Million Order to Enable Power Link in South China
Mentor Graphics Expands Mentor Embedded Linux Support for the Latest AMD Embedded G-series Family of Processors
GRAITEC and SigmaTEK Systems Sign A Partnership Agreement
Infineon Introduces Online Prototyping - Infineon Designer
Mentor Graphics Partners with Telemotive on Smart Charging Technology for Plug-in Vehicles

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  La Bella Bakery Artisan Bakery Arizona

Visit  JobsWare.com





 
  ©2016 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)