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PVA Tepla and Imec Demonstrate 3D Through-silicon Via (TSV) Void Detection Using GHz Scanning Acoustic Microscopy - Scanning acoustic microscopy (SAM) for non-destructive void inspection after wafer bonding improves wafer thinning performance and tool stability and can also be applied to detect voids in TSVs during processing - PvaTepla.com / imec.be
PVA Tepla and Imec Demonstrate 3D Through-silicon Via (TSV) Void Detection Using GHz Scanning Acoustic Microscopy

 

NewswireToday - /newswire/ - Leuven, Belgium, 2013/01/17 - Scanning acoustic microscopy (SAM) for non-destructive void inspection after wafer bonding improves wafer thinning performance and tool stability and can also be applied to detect voids in TSVs during processing - PvaTepla.com / imec.be.

   
 
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Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.

The initial focus of the collaboration was on developing metrology aimed at detecting voids after temporary wafer bonding, allowing for proper rework of 3D wafers. Temporary wafer (de)bonding and thin wafer handling remains challenging for 3D stacked IC technology. The development of interface particles and voids during the temporary bonding process has a detrimental impact on the subsequent wafer thinning process steps, affecting the wafer thinning performance as well as long-term tool stability and performance. PVA Tepla and imec have developed an automated foup-to-foup, wafer-level process based on 200MHz Scanning Acoustic Microscopy (SAM) using Tepla’s AutoWafer 300 tool.

After demonstrating non-destructive detection of interface particles and voids, imec used PVA Tepla’s high-resolution capability GHz frequency SAM tool to successfully detect voids in TSVs of 5µm diameter and 50µm depth, immediately after plating. Future work will concentrate on further refining the process and implementing GHz SAM capability to increase the spatial detection resolution. Moreover, imec and PVA Tepla will investigate the applicability of GHz SAM to detect submicron voids in TSV and to investigate other aspects related to 3D-technology such as bump connection quality.

About imec
Imec (imec.be) performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of close to 2,000 people includes more than 600 industrial residents and guest researchers. In 2011, imec's revenue (P&L) was about 300 million euro.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.) and imec India (Imec India Private Limited).

About PVA TePla
PVA TePla Analytical Systems GmbH (pvatepla.com) is a member of the PVA TePla AG group. The company develops advanced technology developments in scanning acoustic microscopy and provides innovative analytical solutions for applications in material science, biology, inspection of solar and semiconductor systems, as well as for defect analysis in ingots for the production of wafers and MEMS systems.

PVA TePla Group is a specialist for high-temperature and vacuum furnaces. Its core competencies are in the fields of hard-metal sintering and crystal growing, the application of plasma systems for surface activation and ultra-fine cleaning as well as the application of inspection systems for high tech materials.

Contact: PVA TePla: Sandy Kolbe, Executive Assistance
T: +49 (0)7363 9544 200 - E: sandy.kolbe[.]pvatepla.com.

 
 
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Written by / Agency / Source: Imec

 
 

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PVA Tepla and Imec Demonstrate 3D Through-silicon Via (TSV) Void Detection Using GHz Scanning Acoustic Microscopy

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Imec | PVA TePla
Publisher Contact: Hanne Degans - imec.be 
+32 16 28 17 69 / +32 486 065 175 (mobile) hanne.degans[.]imec.be
 
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