PRTODAY / NewswireToday Free press release distribution service network

Written by / Agency / Source: QUALCOMM, Inc.

Check Ads Availability|e-mail Article


Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!

Qualcomm Third Generation LTE Chipsets are First to Support HSPA+ Release 10, LTE Advanced with LTE Carrier Aggregation - Qualcomm Incorporated (NASDAQ: QCOM) announced that its next generation Gobi™ modem chipsets, the MDM8225™, MDM9225™ and MDM9625™ chipsets, will begin sampling in Q4 2012
Qualcomm Third Generation LTE Chipsets are First to Support HSPA+ Release 10, LTE Advanced with LTE Carrier Aggregation

 

NewswireToday - /newswire/ - Barcelona, Spain, 2012/02/27 - Qualcomm Incorporated (NASDAQ: QCOM) announced that its next generation Gobi™ modem chipsets, the MDM8225™, MDM9225™ and MDM9625™ chipsets, will begin sampling in Q4 2012. NASDAQ: QCOM

   
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Telecom/Wireless/VoIP/IPTV Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!

World needs to know about google malpractices - Share your Adsense publishers stories on Google tactics to steal your revenues

 

Qualcomm Incorporated today announced that its next generation Gobi™ modem chipsets, the MDM8225™, MDM9225™ and MDM9625™ chipsets, will begin sampling in Q4 2012 and will be the first to support both HSPA+ Release 10 and the next-generation of the LTE mobile broadband standard, LTE Advanced. The MDM9225 and MDM9625 chipsets are also the first to support LTE carrier aggregation and true LTE Category 4 with data rates of up to 150 Mbps and give network operators increased broadband speeds across their LTE service areas. Implemented in a 28nm manufacturing process, the chipsets will feature significant improvements in performance and power consumption from previous generations and provide support for multiple mobile broadband technologies to deliver a best-in-class mobile broadband experience for smartphones, tablets, ultra-portable notebooks, portable hotspots, dongles and CPEs (Customer Premises Equipment).

LTE carrier aggregation is an important technology that combines multiple radio channels within and across bands to increase user data rates, reduce latency and enable Category 4 capabilities for operators without 20 MHz of continuous spectrum. The MDM9225 and MDM9625 chipsets are the only mobile broadband chipsets currently supporting carrier aggregation that allow OEMs to build devices that can take full advantage of LTE Advanced networks.

The MDM9225 and MDM9625 chipsets are Qualcomm’s third generation of LTE modem chipsets. In addition to supporting both LTE Advanced (LTE Release 10) and HSPA+ Release 10 (including 84 Mbps dual carrier HSDPA), they are backward compatible with other standards including EV-DO Advanced, TD-SCDMA and GSM. The chipsets contain the industry's only modems to integrate 7 different radio access modes on a single baseband chip: cdma2000 (1X, DO), GSM/EDGE, UMTS (WCDMA, TD-SCDMA) and LTE (both LTE-FDD and LTE-TDD). This will allow OEMS to design mobile devices that can operate on the increasingly diverse set of radio network deployments and configurations used worldwide.

“Our newest generation of Gobi modem chipsets will allow mobile device OEMs to design products that can operate on nearly any mobile broadband network worldwide,” said Cristiano Amon, senior vice president of product management, Qualcomm. “In addition to supporting the latest mobile broadband technologies, these chipsets improve over Qualcomm’s previous 7-mode 28nm LTE chipsets (MDM9x15) by offering a reduction in power consumption and overall board area, enabling OEMs to design smaller, sleeker devices with longer battery life.”

The third-generation Gobi modem chipsets also have an integrated application processor and hardware accelerators with a feature rich, Linux-based application development environment and optional mobile access point software stack. Customers can differentiate their MDM8225/9x25 chipset based devices by using the application development environment to create value-added applications. When paired with the Qualcomm Atheros AR6003 or AR6004 chipsets, the mobile access point software stack enables customers to design high performance, low power portable and fixed 802.11n routers. These routers would deliver up to 150 Mbps data connections to Wi-Fi-capable devices.

The MDM8225 chipset supports UMTS only devices, the MDM9225 chipset supports LTE and UMTS devices and the MDM9625 chipset supports LTE, UMTS and CDMA2000 devices. All three chipsets are expected to begin sampling in Q4 2012.

About Qualcomm
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G and next-generation mobile technologies. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company’s ability to successfully design and have manufactured significant quantities of components on a timely and profitable basis, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 25, 2011, and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. Gobi, MDM8225, MDM9225, MDM9625 are trademarks of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.

Qualcomm Contact
Warren Kneeshaw, Investor Relations
P: 1-858-658-4813 - E: ir[.]qualcomm.com.

 
 
Your Banner Ad Here instead - Showing along with ALL Articles covering Telecom/Wireless/VoIP/IPTV Announcements

Replace these Affiliate Programs at ANYTIME! Your banner here within the next hour. Learn How!

World needs to know about google malpractices - Share your Adsense publishers stories on Google tactics to steal your revenues

 

Written by / Agency / Source: QUALCOMM, Inc.

 
 

Availability: All Regions (Including Int'l)

 

Traffic Booster: [/] Quick Newswire Today Visibility Checker

 

Distribution / Indexing: [+] / [Company listed above is a registered member of our network. Content made possible by PRZOOM / PRTODAY indexing services]

 
 
# # #
 
 
  Your Banner Ad showing on ALL
Telecom/Wireless/VoIP/IPTV articles,
CATCH Visitors via Your Competitors Announcements!


Qualcomm Third Generation LTE Chipsets are First to Support HSPA+ Release 10, LTE Advanced with LTE Carrier Aggregation

Company website links NOT available to basic submissions
It is OK to republish and/or LINK any newswire for any legitimate media purpose as long as you name Newswire Today and LINK as the source.
 
  Is this your article?
Activate ALL web links and social stream by Upgrading to Press Release PREMIUM Plan Now!

Qualcomm Incorporated |
Publisher Contact: Tina Asmar - Qualcomm.com 
+1 858-845-5959 corpcomm[.]qualcomm.com
 
Newswire Today - PRZOOM / PRTODAY disclaims any content contained in this article. If you need/wish to contact the company who published the current release, you will need to contact them - NOT us. Issuers of articles are solely responsible for the accuracy of their content. Our complete disclaimer appears here.
IMPORTANT INFORMATION: Issuance, publication or distribution of this press release in certain jurisdictions could be subject to restrictions. The recipient of this press release is responsible for using this press release and the information herein in accordance with the applicable rules and regulations in the particular jurisdiction. This press release does not constitute an offer or an offering to acquire or subscribe for any QUALCOMM, Inc. securities in any jurisdiction including any other companies listed or named in this release.

Telecom/Wireless/VoIP/IPTV via RSSAdd NewswireToday - PRZOOM Headline News to FeedBurner
Find who RetweetFollow @NewswireTODAY



Are you the owner of this article?, Turn it PREMIUM with your LOGO instead - and make it 3rd party Ads-Free! within the next hour!


Read Latest Articles From QUALCOMM, Inc. / Company Profile


Read Telecom/Wireless/VoIP/IPTV Most Recent Related Newswires:

Nokia Receives the New Product Innovation Award at Frost & Sullivan’s Awards Gala Honouring Best-in-Class Companies
Qualcomm Begins Commercial Sampling of World’s First 10nm Server Processor and Reshapes the Future of Datacenter Computing
Grandstream Releases a New WiFi Access Point for Beta Testing
IDC MarketScape Names HCL a Leader for Worldwide Internet of Things Consulting and Systems Integration Services
India’s First Payments Bank Goes LIVE-Airtel Payments Bank Starts Pilot Services in Rajasthan
Grandstream Introduces New Mid-Range IP Phones
Qualcomm and Samsung Collaborate on 10nm Process Technology for the Latest Snapdragon 835 Mobile Processor
Axiata Announces Completion of Bangladesh’s First Telecoms Merger with Bharti Airtel
NEC Develops 5G Massive-element Active Antenna System that Supports 28GHz Band
Grandstream Expands into WiFi Market with New Managed WiFi Access Point
Qualcomm and Tencent Announce Joint Innovation Center in China
Qualcomm Announces 5G NR Spectrum Sharing Prototype System
Verizon Acquires LQD WiFi to Humanize the Citizen Engagement Experience
Grandstream Announces New 4-Port ATA with Gigabit NAT Router
Qualcomm and Preh Sign Commercial Wireless Electric Vehicle Charging License Agreement

Boost Your Social Network
& Crowdfunding Campaigns


LIFETIME SOCIAL MEDIA WALL
NewswireToday Celebrates 10 Years in Business


PREMIUM Members


Visit  La Bella Bakery Artisan Bakery Arizona

Visit  BizJobs.com





 
  ©2016 Newswire Today — Limelon Advertising, Co.
Home | About | Advertise/Pricing | Contact | Investors | Privacy/TOS | Sitemap | FRANCAIS
newswire, PR free press releases distribution service magazines engine news alert newsroom press room breaking news public relations articles company news alerts newswiredistribution ezine bizentrepreneur biznewstoday digital business report market search pr firms agencies reports distri-bution today investor relation successful internet entrepreneurs newswire distribution prtoday.com freenewswiredistribution asianewstoday bizwiretoday USA pr UK today - NOT affiliated with PRNewswire as we declined their partnership offer in 2013
 
PRTODAY & NewswireTODAY are NOT affiliated with USA TODAY (usatoday.com)