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Hesse & Knipps, Inc. to Demo Next Generation Fully Automatic Heavy Wire Bonder at APEC 2012 - Heavy Wire Bonder features support power electronics requirements - Hesse-Knipps.com / WireBondDemo.com
Hesse & Knipps, Inc. to Demo Next Generation Fully Automatic Heavy Wire Bonder at APEC 2012

 

NewswireToday - /newswire/ - Fremont, CA, United States, 2012/01/10 - Heavy Wire Bonder features support power electronics requirements - Hesse-Knipps.com / WireBondDemo.com.

   
 
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Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ939 Heavy Wire Bonder at the APEC 2012 (apec-conf.org/) Exposition taking place on February 6-8, 2012 in Orlando, FL. 

The BONDJET BJ939 Heavy Wire Bonders feature a heavy wire bond head with integrated pull test and large table travel (305 mm x 410 mm) that meets automotive electronics and power semiconductor requirements. “The BONDJET BJ939 Heavy Wire Bonders provide the large current carrying capacity and high reliability that power electronics manufacturers demand,” states Joseph S. Bubel, president of Hesse & Knipps, Inc. “They are also the fastest heavy wire bonders available today.”

The BONDJET BJ939 handles aluminum, gold and copper heavy round wire and ribbon wire at speeds of 3 wires/sec. Patented PiQC Process Integrated Quality Control analyzes 5 critical measurements of bond quality in real time for every bond, ensuring that only reliable, high quality devices are produced.
APEC attendees can learn more about BONDJET BJ939 Heavy Wire Bonder capabilities at Hesse & Knipps’ booth – number 914. To schedule a private demo, contact Hesse & Knipps at 408-436-9300 or info[.]hesse-knipps.us.  Product information is also available on Hesse & Knipps' website and wire bonding videos can be viewed at wirebonddemo.com.

About Hesse & Knipps

Hesse & Knipps GmbH Semiconductor Equipment (hesse-knipps.com / hesse-knipps.de), a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

 
 
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Hesse & Knipps, Inc. to Demo Next Generation Fully Automatic Heavy Wire Bonder at APEC 2012

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